| 國立臺灣科技大學 |
2009 |
Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn lead-free solders with the Au/Ni/SUS 304 substrate
|
Chen K.-D.; Chen H.; Yen Y.-W. |
| 國立臺灣科技大學 |
2009 |
Cross-interaction between au/sn and cu/sn interfacial reactions
|
Yen Y.-W.; Tseng H.W.; Zeng K.; Wang S.J.; Liu C.Y. |
| 國立臺灣科技大學 |
2009 |
Phase equilibria of the Au-Sn-Zn ternary system and interfacial reactions in Sn-Zn/Au couples
|
Liou W.-k.; Yen Y.-W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
|
Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D. |
| 國立臺灣科技大學 |
2009 |
Foreword
|
Chen, C.M.;Chada, S.;Chen, S.W.;Flandorfer, H.;Greer, A.L.;Lee, J.H.;Zeng, K.J.;Yen, Y.W.;Gierlotka, W.;Wang, C.H. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2009 |
Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates
|
Liou, W.K.;Yen, Y.W.;Jao, C.C. |
| 國立臺灣科技大學 |
2008 |
Driver IC and COG package design
|
Yen Y.-W.; Lee C.-Y. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Phase equilibria of the Fe-Cr-Ni ternary systems and interfacial reactions in Fe-Cr alloys with Ni substrate
|
Yen, Y.-w.;Su, J.-w.;Huang, D.-p. |
| 國立臺灣科技大學 |
2008 |
Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers
|
Yen, Y.-w.;Huang, M.-D.;Lin, F.-J. |
| 國立成功大學 |
2008 |
The CL emission observation of the InGaN/GaN MQWs V shaped pits with different superlattices underlayers
|
Lai, W. C.; Huang, Y. S.; Yen, Y. W.; �Sheu, �Jinn-Kong; Hsueh, T. H.; �Kuo,� C. H.; �Chang,� Shoou-Jinn |
| 國立臺灣科技大學 |
2007 |
Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications
|
Yen, Y.-W.;Kuo, Y.-L.;Chen, J.-Y.;Lee, C.;Lee, C.-Y. |
| 國立臺灣科技大學 |
2007 |
A DSC study on the kinetics of disproportionation reaction of (hfac)CuI(COD)
|
Chen, G.;Lee, C.;Kuo, Y.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2007 |
Electroenhanced metallorganic chemical vapor deposition of copper films
|
Kuo, Y.-L.;Lee, C.;Chen, G.;Liu, K.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2007 |
Investigation of the phase equilibria of Sn-Cu-Au ternary and Ag-Sn-Cu-Au quaternary systems and interfacial reactions in Sn-Cu/Au couples
|
Yen, Y.-W.;Jao, C.-C.;Hsiao, H.-M.;Lin, C.-Y.;Lee, C. |
| 國立臺灣科技大學 |
2007 |
Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
|
Yen, Y.-W.;Liou, W.-K. |
| 國立臺灣科技大學 |
2007 |
A DSC study on the kinetics of disproportionation reaction of (hfac)Cu-I(COD)
|
Chen, G.;Lee, C.;Kuo, Y.L.;Yen, Y.W. |
| 國立臺灣科技大學 |
2006 |
The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition
|
Kuo, L.-C.;Huang, Y.-C.;Lee, C.-L.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2006 |
Mesoporous, self-assembled palladium nanospheres: High efficiency activator for electroless nickel deposition
|
Lee, C.-L.;Kuo, L.-C.;Huang, Y.-C.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2006 |
A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive
|
Lee, H.H.;Lee, C.;Kuo, Y.L.;Yen, Y.W. |
| 國立臺灣科技大學 |
2005 |
Reaction mechanism of the two-step MOCVD of copper thin film using Cu(hfac)(2)center dot H2O source
|
Lee, C.;Lee, H.H.;Yen, Y.W.;Kuo, Y.L. |
