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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立臺灣科技大學 2009 Foreword Chen, C.M.;Chada, S.;Chen, S.W.;Flandorfer, H.;Greer, A.L.;Lee, J.H.;Zeng, K.J.;Yen, Y.W.;Gierlotka, W.;Wang, C.H.
國立臺灣科技大學 2009 Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate Liou, W.K.;Yen, Y.W.;Chen, K.D.
國立臺灣科技大學 2009 Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates Liou, W.K.;Yen, Y.W.;Jao, C.C.
國立臺灣科技大學 2008 Driver IC and COG package design Yen Y.-W.; Lee C.-Y.
國立臺灣科技大學 2008 Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.
國立臺灣科技大學 2008 Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.
國立臺灣科技大學 2008 Phase equilibria of the Fe-Cr-Ni ternary systems and interfacial reactions in Fe-Cr alloys with Ni substrate Yen, Y.-w.;Su, J.-w.;Huang, D.-p.
國立臺灣科技大學 2008 Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers Yen, Y.-w.;Huang, M.-D.;Lin, F.-J.
國立成功大學 2008 The CL emission observation of the InGaN/GaN MQWs V shaped pits with different superlattices underlayers Lai, W. C.; Huang, Y. S.; Yen, Y. W.; �Sheu, �Jinn-Kong; Hsueh, T. H.; �Kuo,� C. H.; �Chang,� Shoou-Jinn
國立臺灣科技大學 2007 Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications Yen, Y.-W.;Kuo, Y.-L.;Chen, J.-Y.;Lee, C.;Lee, C.-Y.
國立臺灣科技大學 2007 A DSC study on the kinetics of disproportionation reaction of (hfac)CuI(COD) Chen, G.;Lee, C.;Kuo, Y.-L.;Yen, Y.-W.
國立臺灣科技大學 2007 Electroenhanced metallorganic chemical vapor deposition of copper films Kuo, Y.-L.;Lee, C.;Chen, G.;Liu, K.-L.;Yen, Y.-W.
國立臺灣科技大學 2007 Investigation of the phase equilibria of Sn-Cu-Au ternary and Ag-Sn-Cu-Au quaternary systems and interfacial reactions in Sn-Cu/Au couples Yen, Y.-W.;Jao, C.-C.;Hsiao, H.-M.;Lin, C.-Y.;Lee, C.
國立臺灣科技大學 2007 Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate Yen, Y.-W.;Liou, W.-K.
國立臺灣科技大學 2007 A DSC study on the kinetics of disproportionation reaction of (hfac)Cu-I(COD) Chen, G.;Lee, C.;Kuo, Y.L.;Yen, Y.W.
國立臺灣科技大學 2006 The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition Kuo, L.-C.;Huang, Y.-C.;Lee, C.-L.;Yen, Y.-W.
國立臺灣科技大學 2006 Mesoporous, self-assembled palladium nanospheres: High efficiency activator for electroless nickel deposition Lee, C.-L.;Kuo, L.-C.;Huang, Y.-C.;Yen, Y.-W.
國立臺灣科技大學 2006 A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive Lee, H.H.;Lee, C.;Kuo, Y.L.;Yen, Y.W.
國立臺灣科技大學 2005 Reaction mechanism of the two-step MOCVD of copper thin film using Cu(hfac)(2)center dot H2O source Lee, C.;Lee, H.H.;Yen, Y.W.;Kuo, Y.L.

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