| 國立臺灣科技大學 |
2014 |
Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation
|
Diyatmika, W.;Chu, J.P.;Yen, Y.W.;Chang, W.Z.;Hsueh, C.H. |
| 國立臺灣科技大學 |
2014 |
Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain
|
Lin, C.-P.;Chen, C.-M.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of high-Bi alloys on various substrates
|
Wang, J.-Y.;Chen, C.-M.;Yen, Y.-W. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates
|
Yen, Y.-W.;Hsieh, Y.-P.;Jao, C.-C.;Chiu, C.-W.;Li, Y.-S. |
| 國立臺灣科技大學 |
2013 |
Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn
|
Diyatmika, W.;Chu, J.P.;Yen, Y.W.;Hsueh, C.H. |
| 國立臺灣科技大學 |
2013 |
Investigation of interfacial reactions in the Sn/Fe-xNi couple
|
Yen, Y.-W.;Chen, B.-J.;Li, Y.-S. |
| 國立臺灣科技大學 |
2013 |
Effects of annealing on Sn whisker formation: Role of Cu alloy seed layer
|
Diyatmika, W.;Chu, J.P.;Yen, Y.W. |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2013 |
Aging and Cu concentration effects on Sn-9Zn-xCu/Au couples
|
Yen, Y.-W.;Liou, W.-K.;Chen, W.-C.;Chiu, C.-W. |
| 國立臺灣科技大學 |
2012 |
Dissolution behaviors of the Ni and Ni3Sn4 phase in molten lead-free solders
|
Yen, Y.-W.;Kuo, M.-H.;Liou, W.-K.;Chu, T.-N. |
| 國立臺灣科技大學 |
2012 |
Phase equilibria of the Sn-Bi-Cu ternary system in advanced microelectronic packaging
|
Yen, Y.-W.;Hsiao, H.-M.;Jhang, G.-J.;Shi, H.-W.;Huang, M.-K. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates
|
Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
|
Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
|
Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立臺灣科技大學 |
2012 |
Foreword
|
Chen, C.-M.;Flandorfer, H.;Chen, S.-W.;Lee, J.-H.;Yen, Y.-W.;Schmetterer, C.;Ohnuma, I.;Wang, C.-H. |
| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣科技大學 |
2011 |
ACF particle distribution in COG process
|
Yen, Y.W.;Lee, C.Y. |
| 國立臺灣科技大學 |
2011 |
Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System
|
Yen, Y.W.;Li, C.K.;Tsou, M.Y.;Shao, P.S. |
| 國立臺灣科技大學 |
2011 |
Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn Layer with NiP/Ni/Cu and Ni/Cu Multilayer Systems
|
Yen, Y.W.;Liou, W.K.;Jao, C.C. |
| 國立臺灣科技大學 |
2010 |
Interfacial reactions of pure Sn, Sn-3.0Ag-0.5Cu and Sn-9.0Zn lead-free solders with the Fe-42Ni substrate
|
Hsieh Y.-P.; Jao C.-C.; Yen Y.-W. |
| 國立臺灣科技大學 |
2010 |
Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions
|
Lin S.-K.; Chen K.-D.; Chen H.; Liou W.-K.; Yen Y.-W. |
| 國立臺灣科技大學 |
2010 |
Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials Foreword
|
Chen, C.M.;Chada, S.;Chen, S.W.;Flandorfer, H.;Greer, A.L.;Lee, J.H.;Zeng, K.J.;Yen, Y.W.;Gierlotka, W.;Wang, C.H. |
| 國立臺灣科技大學 |
2010 |
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multi layer Substrate
|
Yen, Y.W.;Liaw, D.W.;Chen, K.D.;Chen, H. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser
|
Lo S.-C.; Hsieh Y.-P.; Yen Y.-W. |
| 國立臺灣科技大學 |
2009 |
Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate
|
Liou W.-K.; Yen Y.-W.; Jao C.-C. |
