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Institution Date Title Author
國立臺灣科技大學 2020 Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate Liu, C.-Y.;Kuo, P.-C.;Chen, Chen C.-M.;Dai, J.-Y.;Yen, Yen Y.-W.;Pasana, A.S.
國立臺灣科技大學 2019 Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and Cu[sbnd]Ti alloy (C1990HP) Yen, Yen Y.-W.;Laksono, A.D.;Yang, C.-Y.
國立臺灣科技大學 2019 Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys Yen, Yen Y.-W.;Yu, W.;Wang, C.-H.;Chen, Chen C.-M.;Li, Y.-C.;Chen, P.-Y.;Chen, G.-D.
國立臺灣科技大學 2019 Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T.
國立臺灣科技大學 2019 Improving the solder wettability via atmospheric plasma technology Kencana, S.D.;Kuo, Y.-L.;Yen, Yen Y.-W.;Schellkes, E.;Chuang, W.
國立臺灣科技大學 2019 Interfacial reaction between sn and cu-ti alloy (C1990hp) Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W.
國立臺灣科技大學 2018 Phase equilibria of the Cu-Ni-Zr ternary systems at 800 °C and thermodynamic assessment and metallic glass region prediction for the Cu-Ni-Zr ternary system Hermana, G.N.;Huang, T.-T.;Chen, Chen C.-M.;Lin, C.-H.;Iikubo, S.;Yen, Yen Y.-W.
國立臺灣科技大學 2018 Interfacial reactions between Sn and Au-xCu alloys Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W.
國立臺灣科技大學 2018 Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple Chang, J.-S.;Yen, Yen Y.-W.
國立臺灣科技大學 2018 Dissolution behavior of the Ni substrate and Ni3Sn4 phase in molten lead-free solders Yen, Yen Y.W.;Lin, C.Y.;Yan, J.;Chang, Y.W.;Wang, C.H.;Guo, M.H.

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