| 義守大學 |
2008-06 |
Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
|
Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen;Rong-Sheng Chen |
| 義守大學 |
2008-02 |
Reliability and characteristics of wafer-level chip-scale packages under current stress
|
Po-Ying Chen;Heng-Yu Kung;Yi-Shao Lai;Ming Hsiung Tsai;Wen-Kuan Yeh |
| 國立東華大學 |
2008 |
Size and substrate effects on microstructure and shear properties of solder joints
|
Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su, |
| 國立東華大學 |
2008 |
Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections
|
Song, J. M.; Yi-Shao Lai; Yao-Ren Liu,; Ying-Ta Chiu ,; Wei-Ting Chen, |
| 義守大學 |
2008 |
An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model
|
Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh |
| 義守大學 |
2007/11/19 |
Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process
|
Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai |
| 義守大學 |
2007/10/01 |
Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer
|
Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai |
| 義守大學 |
2007-12 |
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
|
Yen-Hung Lin;Tei-Chen Chen;Ping-Feng Yang;Sheng-Rui Jian;Yi-Shao Lai; 簡賸瑞 |
| 義守大學 |
2007-12 |
Identifications of Nanomechanical Properties of Cu-Sn Crystalline Phases
|
Yi-Shao Lai;Ping-Feng Yang;Sheng-Rui Jian |
| 義守大學 |
2007-11 |
Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process
|
Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai |
| 義守大學 |
2007-10 |
Identification of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds using nanoindentation
|
Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen;Rong-Sheng Chen |
| 義守大學 |
2007-10 |
Characterizations of ZnO thin films deposited onto langasite substrates by r.f. magnetron sputtering
|
Ping-Feng Yang;Hua-Chiang Wen;Sheng-Rui Jian;Yi-Shao Lai;Sean Wu;Rong-Sheng Chen |
| 義守大學 |
2007-08 |
Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation
|
Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen |
| 義守大學 |
2007 |
Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer
|
Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai |
| 義守大學 |
2006/12/11 |
Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique
|
Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu |
| 義守大學 |
2006/12/06 |
Application of submodeling technique to transient drop impact analysis of board-level stacked die packages
|
Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hui-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai |
| 義守大學 |
2006/12/06 |
The effect of stressing history in reliability characteristics
|
Po-Ying Chen ; Heng-Yu Kung ; Yi-Shao Lai ; Wen-Kuan Yeh |
| 義守大學 |
2006-12 |
Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique
|
Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu |
