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Showing items 26-28 of 28  (3 Page(s) Totally)
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Institution Date Title Author
義守大學 2006/12/06 Application of submodeling technique to transient drop impact analysis of board-level stacked die packages Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hui-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2006/12/06 The effect of stressing history in reliability characteristics Po-Ying Chen ; Heng-Yu Kung ; Yi-Shao Lai ; Wen-Kuan Yeh
義守大學 2006-12 Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu

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