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"yi shao lai"的相关文件
显示项目 1-10 / 28 (共3页)
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| 義守大學 |
2013-07 |
Rapid, low temperature microwave synthesis of durable, superhydrophobic carbon nanotube–polybenzoxazine nanocomposites
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Chih-Feng Wang;Hsuan-Yu Chen;Shiao-Wei Kuo;Yi-Shao Lai;Ping-Feng Yang |
| 義守大學 |
2011-01 |
Characteristic of copper wire and transient analysis on wirebonding process
|
Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai |
| 義守大學 |
2010-10 |
Mechanical properties of the hexagonal HoMnO3 thin films by nanoindentation
|
Cheng-Yo Yen;Sheng-Rui Jian;Yi-Shao Lai; Ping-Feng Yang; Ying-Yen Liao;Jason Shian-Ching Jang;Tjung-Han Lin;Jenh-Yih Juang |
| 義守大學 |
2009-10 |
Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding
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Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai |
| 義守大學 |
2008/12/09 |
Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model
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Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai |
| 義守大學 |
2008/10/22 |
An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model
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Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
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Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 義守大學 |
2008-12 |
Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model
|
Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai |
| 國立東華大學 |
2008-10 |
Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance
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Song,J. M.; Yi-Shao Lai,; Li-Wei Lin,; Ying-Ta Chiu; Ning-Cheng Lee |
| 義守大學 |
2008-08 |
Finite Element Prediction of Stack-Die Packages under Board Level Drop Test
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Hsiang-Chen Hsu;Yu-Chia Hsu;Chan-Lin Yeh;Yi-Shao Lai |
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