臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2007/11/19	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007-12	Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon	Yen-Hung Lin;Tei-Chen Chen;Ping-Feng Yang;Sheng-Rui Jian;Yi-Shao Lai; 簡賸瑞
義守大學	2007-12	Identifications of Nanomechanical Properties of Cu-Sn Crystalline Phases	Yi-Shao Lai;Ping-Feng Yang;Sheng-Rui Jian
義守大學	2007-11	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2007-10	Identification of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds using nanoindentation	Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen;Rong-Sheng Chen
義守大學	2007-10	Characterizations of ZnO thin films deposited onto langasite substrates by r.f. magnetron sputtering	Ping-Feng Yang;Hua-Chiang Wen;Sheng-Rui Jian;Yi-Shao Lai;Sean Wu;Rong-Sheng Chen
義守大學	2007-08	Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation	Ping-Feng Yang;Yi-Shao Lai;Sheng-Rui Jian;Jiunn Chen
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2006/12/11	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu

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