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Institution Date Title Author
元智大學 Sep-18 Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學 Sep-18 TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學 Oct-18 High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學 Jun-17 High-speed Cu Electrodeposition and Its Solderability Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學 Jun-17 Depth-dependent Self-annealing Behavior of Electroplated Cu Chang-Chih Chen; Cheng-Hsien Yang; Ying-Syuan Wu; Cheng-En Ho
元智大學 Jan-19 Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學 Feb-19 Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學 Aug-21 High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF) Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho
元智大學 Aug-16 In-situ Study on the Self-annealing Behavior of Electroplated Cu through the Cantilever Method, XRD, and EBSD Cheng-En Ho; Chang-Chih Chen; Ming-Kai Lu; Yu-Wei Lee; Ying-Syuan Wu
元智大學 2018 化鎳鈀金及薄鎳型化鎳鈀金表面處理之焊接應用 吳映璇; Ying-Syuan Wu
元智大學 2017-04-25 Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學 2017-04-25 Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學 2016-10-26 High-Current-Density Electroplating Cu and Its Solderability Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學 2016-10-26 Microstructure and Its Reliability of High-speed Cu Electrodeposition Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho

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