臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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機構	日期	題名	作者
元智大學	Sep-18	Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects	Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Sep-18	TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film	Cheng-En Ho; Chang-Chih Chen; Cheng-Hsien Yang; Pei-Tzu Lee; Wan-Zhen Hsieh; Ying-Syuan Wu
元智大學	Oct-18	High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage	Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho
元智大學	Jun-17	High-speed Cu Electrodeposition and Its Solderability	Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho
元智大學	Jun-17	Depth-dependent Self-annealing Behavior of Electroplated Cu	Chang-Chih Chen; Cheng-Hsien Yang; Ying-Syuan Wu; Cheng-En Ho
元智大學	Jan-19	Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy	Yu-Hsuan Huang; Wan-Zhen Hsieh; Pei-Tzu Lee; Ying-Syuan Wu; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Feb-19	Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad	Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho
元智大學	Aug-21	High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)	Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho
元智大學	Aug-16	In-situ Study on the Self-annealing Behavior of Electroplated Cu through the Cantilever Method, XRD, and EBSD	Cheng-En Ho; Chang-Chih Chen; Ming-Kai Lu; Yu-Wei Lee; Ying-Syuan Wu
元智大學	2018	化鎳鈀金及薄鎳型化鎳鈀金表面處理之焊接應用	吳映璇; Ying-Syuan Wu
元智大學	2017-04-25	Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate	Ying-Syuan Wu; Pei-Tzu Lee; Wei-Yan Shih; Sheng-Wei Lin; Cheng-En Ho
元智大學	2017-04-25	Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities	Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho
元智大學	2016-10-26	High-Current-Density Electroplating Cu and Its Solderability	Pei-Tzu Lee; Chang-Chih Chen; Ying-Syuan Wu; Pin-Chung Lin; Cheng-En Ho
元智大學	2016-10-26	Microstructure and Its Reliability of High-speed Cu Electrodeposition	Ying-Syuan Wu; Chang-Chih Chen; Pei-Tzu Lee; Hung-Cheng Liu; Cheng-En Ho

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