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"ying ta chiu"
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| 義守大學 |
2017-11 |
Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation
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Ying-Xu Lu;Ying-Ta Chiu;Tang-Yuan Chen;Meng-Kai Shih;Sheng-Rui Jian |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
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Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 國立東華大學 |
2008-10 |
Alloying Design of Sn-Ag-Cu Solders for the Improvement in Drop Test Performance
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Song,J. M.; Yi-Shao Lai,; Li-Wei Lin,; Ying-Ta Chiu; Ning-Cheng Lee |
| 國立東華大學 |
2008 |
Size and substrate effects on microstructure and shear properties of solder joints
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Song,J. M.; Yi-Shao Lai,; Gwo-Wei Lee,; Ying-Ta Chiu,; Chien-Wei Su, |
| 國立東華大學 |
2008 |
Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections
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Song, J. M.; Yi-Shao Lai; Yao-Ren Liu,; Ying-Ta Chiu ,; Wei-Ting Chen, |
Showing items 1-5 of 5 (1 Page(s) Totally)
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