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Institution Date Title Author
臺大學術典藏 2020-01-06T03:11:56Z Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature Zhang, T.; Isobe, S.; Nakagawa, Y.; YING-CHIH LIAO; Yong, Y.; Nguyen, M.T.; Yonezawa, T.; Asano, T.; Matsubara, M.; Tsukamoto, H.; Liao, Y.-C.
臺大學術典藏 2020-01-06T03:11:55Z Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns Huang, K.-M.; Tsukamoto, H.; Yong, Y.; Chiu, H.-L.; Nguyen, M.T.; Yonezawa, T.; Liao, Y.-C.; YING-CHIH LIAO
臺大學術典藏 2020-01-06T03:11:54Z Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions Yong, Y.; Nguyen, M.T.; Tsukamoto, H.; Matsubara, M.; Liao, Y.-C.; Yonezawa, T.; YING-CHIH LIAO

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