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2020-01-06T03:11:56Z |
Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
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Zhang, T.; Isobe, S.; Nakagawa, Y.; YING-CHIH LIAO; Yong, Y.; Nguyen, M.T.; Yonezawa, T.; Asano, T.; Matsubara, M.; Tsukamoto, H.; Liao, Y.-C. |
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Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns
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Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions
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