|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"yotsuyanagi h"
Showing items 16-30 of 30 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立臺灣科技大學 |
2017 |
Resistive open defects detected by interconnect testing based on charge volume injected to 3D ICs
|
Ohtani, K.;Osato, N.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
A built-in current sensor made of a comparator of offset cancellation type for electrical interconnect tests of 3D ICs
|
Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A built-in electrical test circuit for detecting open leads in assembled PCB circuits
|
Miyabe, T;Hashizume, M;Yotsuyanagi, H;Lu, S.-K;Roth, Z. |
| 國立臺灣科技大學 |
2016 |
Electrical interconnect test of solder joint part with boundary scan flip flops and a built-in test circuit
|
Hashizume, M;Ikiri, Y;Konishi, T;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A built-in test circuit for electrical interconnect testing of open defects in assembled PCBs
|
Widiant, Hashizume M;Suenaga, Suenaga S;Yotsuyanagi, H;Ono, A;Lu, S.-K;Roth, Z. |
| 國立臺灣科技大學 |
2016 |
A power supply circuit for interconnect tests based on injected charge volume of 3D IC
|
Ohtani, K;Hashizume, M;Suga, D;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
A built-in defective level monitor of resistive open defects in 3D ICs with logic gates
|
Hashizume, M;Odoriba, A;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2016 |
Testability for resistive open defects by electrical interconnect test of 3D ICs without boundary scan flip flops
|
Ali, F.A.B;Hashizume, M;Ikiri, Y;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs by injected charge volume
|
Suga, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit
|
Nanbara, K.;Odoriba, A.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
A testable design for electrical interconnect tests of 3D ICs
|
Odoriba, A.;Umezu, S.;Hashizume, M.;Yotsuyanagi, H.;Ali, F.A.B.;Lu, S.-K. |
| 國立臺灣科技大學 |
2015 |
Electrical interconnect test method of 3D ICs without boundary scan flip flops
|
Hashizume, M;Umezu, S;Ikiri, Y;Ali, F.A.B;Yotsuyanagi, H;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
Reduction method of number of electromagnetic simulation times for estimating output voltage at hard open TSV in 3D IC
|
Haraguchi, E.;Hashizume, M.;Manabe, K.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K.;Roth, Z. |
| 國立臺灣科技大學 |
2013 |
Built-in IDDT appearance time sensor for detecting open faults in 3D IC
|
Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K. |
| 國立臺灣科技大學 |
2013 |
DFT for supply current testing to detect open defects at interconnects in 3D ICs
|
Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.;Roth, Z. |
Showing items 16-30 of 30 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
