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Showing items 26-30 of 30  (1 Page(s) Totally)
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Institution Date Title Author
國立臺灣科技大學 2015 A testable design for electrical interconnect tests of 3D ICs Odoriba, A.;Umezu, S.;Hashizume, M.;Yotsuyanagi, H.;Ali, F.A.B.;Lu, S.-K.
國立臺灣科技大學 2015 Electrical interconnect test method of 3D ICs without boundary scan flip flops Hashizume, M;Umezu, S;Ikiri, Y;Ali, F.A.B;Yotsuyanagi, H;Lu, S.-K.
國立臺灣科技大學 2013 Reduction method of number of electromagnetic simulation times for estimating output voltage at hard open TSV in 3D IC Haraguchi, E.;Hashizume, M.;Manabe, K.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K.;Roth, Z.
國立臺灣科技大學 2013 Built-in IDDT appearance time sensor for detecting open faults in 3D IC Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Tada, T.;Lu, S.-K.
國立臺灣科技大學 2013 DFT for supply current testing to detect open defects at interconnects in 3D ICs Suenaga, S.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.;Roth, Z.

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