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| 臺大學術典藏 |
2018-09-10T04:28:29Z |
An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating
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Liu, R. S.;You, C. C.;Tsai, M. S.;Hu, S. F.;Li, Y. H.;Lu, C. P.; Liu, R. S.; You, C. C.; Tsai, M. S.; Hu, S. F.; Li, Y. H.; Lu, C. P.; RU-SHI LIU |
| 國立臺灣大學 |
2002-08 |
Growth of nano-sized copper seed layer on TiN and TaSiN by new non-toxic electroless plating
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Liu, R.S.; You, C.C.; Tsai, M.S.; Hu, S.F.; Lee, K.; Lu, J. |
| 臺大學術典藏 |
2002-08 |
Growth of nano-sized copper seed layer on TiN and TaSiN by new non-toxic electroless plating
|
Liu, R.S.; You, C.C.; Tsai, M.S.; Hu, S.F.; Lee, K.; Lu, J.; Liu, R.S.; You, C.C.; Tsai, M.S.; Hu, S.F.; Lee, K.; Lu, J.; LiuRS |
| 國立政治大學 |
2001 |
A Cross-National Comparative Analysis of Innovation Policy in the Integrated Circuit Industry
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Shyu, J.Z.;邱奕嘉;You, C.C.; Shyu, J.Z.;Chiu, Y.C.;You, C.C. |
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