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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:41:47Z |
Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrier
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Yang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP |
| 國立交通大學 |
2014-12-08T15:39:00Z |
Fabrication of sub-60-nm contact holes in silicon dioxide layers
|
Ko, FH; You, HC; Chu, TC; Lei, TF; Hsu, CC; Chen, HL |
| 國立交通大學 |
2014-12-08T15:19:40Z |
Resist nano-modification technology for enhancing the lithography and etching performance
|
You, HC; Ko, FH; Lei, TF |
| 國立交通大學 |
2014-12-08T15:17:42Z |
Physical characterization and electrical properties of sol-gel-derived zirconia films
|
You, HC; Fu-Hsiang, K; Lei, TF |
| 國立交通大學 |
2014-12-08T15:16:51Z |
Fullerene-incorporation for enhancing the electron beam resist performance for contact hole patterning and filling
|
You, HC; Ko, FH; Lei, TF |
Showing items 1-5 of 5 (1 Page(s) Totally)
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