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Institution Date Title Author
國立交通大學 2014-12-08T15:41:47Z Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrier Yang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP
國立交通大學 2014-12-08T15:39:00Z Fabrication of sub-60-nm contact holes in silicon dioxide layers Ko, FH; You, HC; Chu, TC; Lei, TF; Hsu, CC; Chen, HL
國立交通大學 2014-12-08T15:19:40Z Resist nano-modification technology for enhancing the lithography and etching performance You, HC; Ko, FH; Lei, TF
國立交通大學 2014-12-08T15:17:42Z Physical characterization and electrical properties of sol-gel-derived zirconia films You, HC; Fu-Hsiang, K; Lei, TF
國立交通大學 2014-12-08T15:16:51Z Fullerene-incorporation for enhancing the electron beam resist performance for contact hole patterning and filling You, HC; Ko, FH; Lei, TF

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