| 臺大學術典藏 |
2020-01-13T08:20:15Z |
Evaluation of structural properties of AZO conductive films modification using low-temperature ultraviolet laser annealing
|
Ding, C.-F.; Hsiao, W.-T.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2020-01-13T08:20:15Z |
Evaluation of deep learning neural networks for surface roughness prediction using vibration signal analysis
|
Lin, W.-J.; Lo, S.-H.; Young, H.-T.; Hung, C.-L.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2020-01-13T08:20:15Z |
Real time monitoring of fs laser annealing on indium tin oxide
|
Wu, P.-H.; Hu, C.-L.; Feng, S.-W.; Young, H.-T.; Lu, M.-Y.; Wang, H.-C.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2020-01-13T08:20:15Z |
Factors influencing online group buying in taiwan: an empirical study based on the tpb framework
|
Hung, C.-C.; Cheng, N.-C.; Yu, S.-E.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2020-01-13T08:20:15Z |
An investigation of alliance portfolio diversity impact on firm performance
|
HONG-TSU YOUNG;Young, H.-T.;Chiang, W.-H.;Wang, C.-H.;Cheng, N.-C.;Yu, S.-E.;Hung, C.-C.; Hung, C.-C.; Yu, S.-E.; Cheng, N.-C.; Wang, C.-H.; Chiang, W.-H.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2020-01-13T08:20:14Z |
Laser-induced backward transfer of conducting aluminum doped zinc oxide to glass for single-step rapid patterning
|
Young, H.-T.; HONG-TSU YOUNG; Ding, C.-F.; Li, L. |
| 臺大學術典藏 |
2019-12-24T09:06:10Z |
The state of charge of electrodes and its effects on lithium-iron-phosphate battery simulation
|
Huang H.H.;Chung W.L.;Liao K.C.;Lee C.F.;Tien J.Y.;Young H.T.;Chen H.Y.; Huang H.H.; Chung W.L.; Liao K.C.; Lee C.F.; Tien J.Y.; Young H.T.; Chen H.Y.; KUO-CHI LIAO |
| 臺大學術典藏 |
2019-12-24T09:06:09Z |
Thermal-electrochemical coupled simulations for cell-to-cell imbalances in lithium-iron-phosphate based battery packs
|
Huang H.-H.;Chen H.-Y.;Liao K.-C.;Young H.-T.;Lee C.-F.;Tien J.-Y.; Huang H.-H.; Chen H.-Y.; Liao K.-C.; Young H.-T.; Lee C.-F.; Tien J.-Y.; KUO-CHI LIAO |
| 臺大學術典藏 |
2019-12-24T09:05:58Z |
Thermal-electrochemical coupled simulations for cell-to-cell imbalances in lithium-iron-phosphate based battery packs
|
Huang H.-H.;Chen H.-Y.;Liao K.-C.;Young H.-T.;Lee C.-F.;Tien J.-Y.; Huang H.-H.; Chen H.-Y.; Liao K.-C.; Young H.-T.; Lee C.-F.; Tien J.-Y.; HSUN-YI CHEN |
| 臺大學術典藏 |
2019-12-24T09:05:58Z |
The state of charge of electrodes and its effects on lithium-iron-phosphate battery simulation
|
Huang H.H.;Chung W.L.;Liao K.C.;Lee C.F.;Tien J.Y.;Young H.T.;Chen H.Y.; Huang H.H.; Chung W.L.; Liao K.C.; Lee C.F.; Tien J.Y.; Young H.T.; Chen H.Y.; HSUN-YI CHEN |
| 臺大學術典藏 |
2019-11-25T07:28:04Z |
Tool condition monitoring with current signals for a low-power spindle
|
KUAN-MING LI;Li K.M.;Young H.T.;Chung T.T.;Huang M.;Wang C.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M.; KUAN-MING LI |
| 臺大學術典藏 |
2019-06-18T06:39:50Z |
Tool condition monitoring with current signals for a low-power spindle
|
Li K.M.;Young H.T.;Chung T.T.;Wang C.;Huang M.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M. |
| 臺大學術典藏 |
2018-09-10T15:32:00Z |
Highly sensitive non-enzymatic electrochemical glucose biosensor using a photolithography fabricated micro/nano hybrid structured electrode
|
Hsu, C.-W.; Su, F.-C.; Peng, P.-Y.; Young, H.-T.; Liao, S.; Wang, G.-J.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T15:20:37Z |
High-speed spindle fault diagnosis with the empirical mode decomposition and multiscale entropy method
|
Hsieh, N.-K.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T14:55:15Z |
An intelligent fault diagnosis system for machine tools
|
HONG-TSU YOUNG;Young, H.-T.;Lin, W.-Y.;Wang, C.;HONG-TSU YOUNG; Wang, C.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application
|
HONG-TSU YOUNG; HONG-TSU YOUNG;Young, H.-T.;Tang, C.-W.;HONG-TSU YOUNG; Tang, C.-W.; Young, H.-T. |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
|
Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:44:04Z |
A method of comparing the speed of starlight and the speed of light from a terrestrial source
|
Chang, S.-T.; Tsao, H.-W.; Huang, Y.-R.; Lee, S.-L.; Chang, C.-C.; Lin, W.-C.; Tsay, H.-L.; Wang, Y.-L.; Huang, P.-H.; Hsu, M.-Y.; Hsu, C.-W.; Lin, S.-C.; Hung, Y.-J.; Shiu, Y.-L.; Hsiao, Y.-C.; Chang, J.-Y.; Tsai, D.P.; Huang, T.-M.; Young, H.-T.; Liu, Y.-C.; Chang, C.-M.; Chiang, W.-C.; Huang, J.-Y.; Chen, Y.-H.; Wu, J.; HEN-WAI TSAO et al. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
|
Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process
|
Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:19:03Z |
Study the keyhole welding performance with enthalpy method in upwind scheme
|
HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T09:19:03Z |
Robust process design towards through-silicon via quality improvement based on Grey-Taguchi method
|
Tang, C.-W.; Chuang, L.-C.; Young, H.-T.; Yang, M.; Liao, H.-C.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Reduction of 2D/3D image cross-talks with micro-optical elements by Nano-imprint
|
Yeh, C.-H.; Chang, F.-Y.; Wang, H.-C.; Chung, E.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Online condition-based shaft faults diagnosis with multiscale entropy
|
Wang, C.; Lin, W.-Y.; Wang, Y.-H.; Young, H-.T.; Lee, K-T.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T; Pan, Y.-H.; HONG-TSU YOUNGet al.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T |
| 臺大學術典藏 |
2018-09-10T08:37:59Z |
Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method
|
Lin, C.-C.; Young, H.-T.; Tang, C.-W.; Tsai, M.-Y.; HONG-TSU YOUNG |
