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機構 日期 題名 作者
臺大學術典藏 2020-01-13T08:20:14Z Laser-induced backward transfer of conducting aluminum doped zinc oxide to glass for single-step rapid patterning Young, H.-T.; HONG-TSU YOUNG; Ding, C.-F.; Li, L.
臺大學術典藏 2019-12-24T09:06:10Z The state of charge of electrodes and its effects on lithium-iron-phosphate battery simulation Huang H.H.;Chung W.L.;Liao K.C.;Lee C.F.;Tien J.Y.;Young H.T.;Chen H.Y.; Huang H.H.; Chung W.L.; Liao K.C.; Lee C.F.; Tien J.Y.; Young H.T.; Chen H.Y.; KUO-CHI LIAO
臺大學術典藏 2019-12-24T09:06:09Z Thermal-electrochemical coupled simulations for cell-to-cell imbalances in lithium-iron-phosphate based battery packs Huang H.-H.;Chen H.-Y.;Liao K.-C.;Young H.-T.;Lee C.-F.;Tien J.-Y.; Huang H.-H.; Chen H.-Y.; Liao K.-C.; Young H.-T.; Lee C.-F.; Tien J.-Y.; KUO-CHI LIAO
臺大學術典藏 2019-12-24T09:05:58Z Thermal-electrochemical coupled simulations for cell-to-cell imbalances in lithium-iron-phosphate based battery packs Huang H.-H.;Chen H.-Y.;Liao K.-C.;Young H.-T.;Lee C.-F.;Tien J.-Y.; Huang H.-H.; Chen H.-Y.; Liao K.-C.; Young H.-T.; Lee C.-F.; Tien J.-Y.; HSUN-YI CHEN
臺大學術典藏 2019-12-24T09:05:58Z The state of charge of electrodes and its effects on lithium-iron-phosphate battery simulation Huang H.H.;Chung W.L.;Liao K.C.;Lee C.F.;Tien J.Y.;Young H.T.;Chen H.Y.; Huang H.H.; Chung W.L.; Liao K.C.; Lee C.F.; Tien J.Y.; Young H.T.; Chen H.Y.; HSUN-YI CHEN
臺大學術典藏 2019-11-25T07:28:04Z Tool condition monitoring with current signals for a low-power spindle KUAN-MING LI;Li K.M.;Young H.T.;Chung T.T.;Huang M.;Wang C.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M.; KUAN-MING LI
臺大學術典藏 2019-06-18T06:39:50Z Tool condition monitoring with current signals for a low-power spindle Li K.M.;Young H.T.;Chung T.T.;Wang C.;Huang M.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M.
臺大學術典藏 2018-09-10T15:32:00Z Highly sensitive non-enzymatic electrochemical glucose biosensor using a photolithography fabricated micro/nano hybrid structured electrode Hsu, C.-W.; Su, F.-C.; Peng, P.-Y.; Young, H.-T.; Liao, S.; Wang, G.-J.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T15:20:37Z High-speed spindle fault diagnosis with the empirical mode decomposition and multiscale entropy method Hsieh, N.-K.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T14:55:15Z An intelligent fault diagnosis system for machine tools HONG-TSU YOUNG;Young, H.-T.;Lin, W.-Y.;Wang, C.;HONG-TSU YOUNG; Wang, C.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T09:45:20Z Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application HONG-TSU YOUNG; HONG-TSU YOUNG;Young, H.-T.;Tang, C.-W.;HONG-TSU YOUNG; Tang, C.-W.; Young, H.-T.
臺大學術典藏 2018-09-10T09:45:20Z Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI
臺大學術典藏 2018-09-10T09:44:04Z A method of comparing the speed of starlight and the speed of light from a terrestrial source Chang, S.-T.; Tsao, H.-W.; Huang, Y.-R.; Lee, S.-L.; Chang, C.-C.; Lin, W.-C.; Tsay, H.-L.; Wang, Y.-L.; Huang, P.-H.; Hsu, M.-Y.; Hsu, C.-W.; Lin, S.-C.; Hung, Y.-J.; Shiu, Y.-L.; Hsiao, Y.-C.; Chang, J.-Y.; Tsai, D.P.; Huang, T.-M.; Young, H.-T.; Liu, Y.-C.; Chang, C.-M.; Chiang, W.-C.; Huang, J.-Y.; Chen, Y.-H.; Wu, J.; HEN-WAI TSAO et al.
臺大學術典藏 2018-09-10T09:19:04Z Innovative through-silicon-via formation approach for wafer-level packaging applications Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M.
臺大學術典藏 2018-09-10T09:19:04Z Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI
臺大學術典藏 2018-09-10T09:19:03Z Study the keyhole welding performance with enthalpy method in upwind scheme HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T09:19:03Z Robust process design towards through-silicon via quality improvement based on Grey-Taguchi method Tang, C.-W.; Chuang, L.-C.; Young, H.-T.; Yang, M.; Liao, H.-C.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T08:37:59Z Reduction of 2D/3D image cross-talks with micro-optical elements by Nano-imprint Yeh, C.-H.; Chang, F.-Y.; Wang, H.-C.; Chung, E.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T08:37:59Z Online condition-based shaft faults diagnosis with multiscale entropy Wang, C.; Lin, W.-Y.; Wang, Y.-H.; Young, H-.T.; Lee, K-T.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T; Pan, Y.-H.; HONG-TSU YOUNGet al.; Pan, Y-H; Wang, C.; Lin, W-Y; Wang, Y-H; Young, H-T; Lee, K-T
臺大學術典藏 2018-09-10T08:37:59Z Enhancing fracture strength of thinned silicon dies by a hybrid micromachining method Lin, C.-C.; Young, H.-T.; Tang, C.-W.; Tsai, M.-Y.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T08:37:59Z Condition-based shaft fault diagnosis with the empirical mode decomposition methodg Lin, W.-Y. Chuang, L.-C. Young, H.-T.Lin, W-Y;Chuang, L-C;Young, H-T; 楊偉勛; 陳沛隆
臺大學術典藏 2018-09-10T08:37:59Z Development of diagnosis system for machine tool shaft inspection Hsieh, N.-K.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T08:11:08Z Modelling on dressing effects in chemical mechanical polishing with diamond dressers Chen, K.-R.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T08:11:08Z Evaluating the micromachining rate of nanosecond laser with thermal analysis Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T07:31:37Z Application of co-sputtered Cu-Ni micro metallic strain gage for structure response monitoring HONG-TSU YOUNG;Lin, H.-B.;Chuang, L.-C.;Young, H.-T.;Lo, H.-S.;Ting, J.-M.;Wang, Y.-S.;Jenq, S.-T.;HONG-TSU YOUNG; Jenq, S.-T.; Wang, Y.-S.; Ting, J.-M.; Lo, H.-S.; Young, H.-T.; Chuang, L.-C.; Lin, H.-B.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T07:31:37Z Project-management of diversified product design parameters for concurrent engineering Kang, M.-Y.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T07:31:36Z Measuring the magnetization of nano ferro-fluid with D.C electromagnetic application Ho, J.E.; Young, H.T.; Ho, J.-E. and Young, H.T.; Ho, J.E.; HONG-TSU YOUNG; Young, H.T.; Gau, Susan Shur-Fen
臺大學術典藏 2018-09-10T07:31:36Z Estimation of dressing effects in chemical mechanical polishing with sorts of diamond dressers Chen, K.-R.; Young, H.-T.; Chen, K.R.; Young, H.T.; Chen, K.R.; Tsai, P.-L.; HONG-TSU YOUNG; Young, H.T.; Chen, M.-C.; Huang, Y.-T.; Lin, K.-C.; Chen, K.-L.; Hsu, Y.-W.
臺大學術典藏 2018-09-10T07:31:36Z Approaches of aviation accident investigation in different cultural contexts from human factors perspectives HONG-TSU YOUNG;Li, L.-W.;Harris, D.;Wang, T.;Young, H.-T.;Li, W.-C.;HONG-TSU YOUNG; Li, W.-C.; Young, H.-T.; Wang, T.; Harris, D.; Li, L.-W.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:58:52Z The analysis on penetrating efficiency in high-energy beam drilling HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:58:52Z Precision wafer thinning and its surface conditioning technique Young, H.-T.; Lin, C.-C.; Liao, H.-T.; Yang, M.; Young, H T.; Lin, C C.; Liao, H T.; Yang, M.; HONG-TSU YOUNG; Young, H T.; Lin, C C.; Liao, H T.; Yang, M.; LIN, YU-CHENG; CHANG, PI-FENG; HU, FU- CHANG; CHANG, MEI-HWEI; NI, YEN-HSUAN; 倪衍玄;張美惠;胡賦強;張碧峰;NI, YEN-HSUAN林裕誠;CHANG, MEI-HWEI;HU, FU- CHANG;CHANG, PI-FENG;LIN, YU-CHENG;Yang, M.;Liao, H T.;Lin, C C.;Young, H T.;HONG-TSU YOUNG;Yang, M.;Liao, H T.;Lin, C C.;Young, H T.;Yang, M.;Liao, H.-T.;Lin, C.-C.;Young, H.-T.
臺大學術典藏 2018-09-10T06:58:52Z Novel approach to fabrication of 3D micro-structures by laser machining Young, H.-T.; Lin, F.-F.; Hong, S.-B.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:58:52Z 3D micro-scale profile measuring system HONG-TSU YOUNG;Lin, W.Y.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, W.Y.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:25:55Z Integrated rough machining methodology for centrifugal impeller manufacturing Chuang, L.-C.; Young, H.-T.; Chung, E.; Young, H.T.; HONG-TSU YOUNG; Chung, E.
臺大學術典藏 2018-09-10T06:25:55Z ALLOWING FOR NOSE RADIUS EFFECTS IN PREDICTING THE CHIP FLOW DIRECTION AND CUTTING FORCES IN BAR TURNING. HONG-TSU YOUNG;Oxley, P.L.B.;Mathew, P.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:25:54Z The relationship between the location of obstacle and indoor particle deposition HONG-TSU YOUNG;Young, H.T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:25:54Z Study of the flow field and scalar transport of indoor ventilating space under the impact of coanda vortex HONG-TSU YOUNG;Young, H.-T.;Ho, J.-E.;HONG-TSU YOUNG; Ho, J.-E.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:25:54Z Novel method to investigate the critical depth of cut of ground silicon wafer Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T06:25:54Z Nonlinear penetrating behavior in high energy beam drilling HONG-TSU YOUNG; Ho, J.E.; Young, H.T.
臺大學術典藏 2018-09-10T05:53:59Z Online dressing of profile grinding wheels Young, H.-T.; Chen, D.-J.; Young, H.T.; Chen, D.J.; Young, H.T.; HONG-TSU YOUNG; Chen, D.J.
臺大學術典藏 2018-09-10T05:53:59Z Development of automatic 3D profile measuring system Young, H.-T.; Lin, W.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T05:53:59Z A study on wafer thinning techniques with residual stress estimation HONG-TSU YOUNG;Liao, H.-T.;Chang, M.-T.;Lin, C.-C.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Lin, C.-C.; Chang, M.-T.; Liao, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T05:53:59Z A fundamental modeling approach for nano-grinding of silicon wafers HONG-TSU YOUNG;Yang, Y.-J.;Huang, H.-Y.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Huang, H.-Y.; Yang, Y.-J.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T05:53:59Z Cutting temperature responses to flank wear Young, H.-T.; Young, Hong-Tsu
臺大學術典藏 2018-09-10T05:53:59Z ALLOWING FOR END CUTTING EDGE EFFECTS IN PREDICTING FORCES IN BAR TURNING WITH OBLIQUE MACHINING CONDITIONS. HONG-TSU YOUNG;Young, H.T.;Oxley, P.L.B.;Mathew, P.;Hu, R.S.;HONG-TSU YOUNG; Hu, R.S.; Mathew, P.; Oxley, P.L.B.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T05:53:58Z Surface integrity of silicon wafers in ultra precision machining HONG-TSU YOUNG;Huang, H.-Y.;Liao, H.-T.;Young, H.T.;HONG-TSU YOUNG; Young, H.T.; Liao, H.-T.; Huang, H.-Y.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T05:19:08Z Quantitative reliability analysis of electronic packages in consideration of variability of model parameters Wu, W.-F.; Lin, Y.-Y.; Young, H.-T.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T04:50:10Z An analytical model of chatter vibration in metal cutting HONG-TSU YOUNG;Lee, B.Y.;Young, H.T.;Tarng, Y.S.;HONG-TSU YOUNG; Tarng, Y.S.; Young, H.T.; Lee, B.Y.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T04:50:09Z A five-axis rough machining approach for a centrifugal impeller HONG-TSU YOUNG;Kamps, S.;Gerschwiler, K.;Chuang, L.-C.;Young, H.-T.;HONG-TSU YOUNG; Young, H.-T.; Chuang, L.-C.; Gerschwiler, K.; Kamps, S.; HONG-TSU YOUNG
臺大學術典藏 2018-09-10T04:50:09Z Predicting cutting forces in face milling Young, H.-T.; Mathew, P.; Oxley, P.L.B.; HONG-TSU YOUNG

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