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"young h t"的相關文件
顯示項目 71-80 / 196 (共20頁)
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| 臺大學術典藏 |
2019-11-25T07:28:04Z |
Tool condition monitoring with current signals for a low-power spindle
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KUAN-MING LI;Li K.M.;Young H.T.;Chung T.T.;Huang M.;Wang C.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M.; KUAN-MING LI |
| 臺大學術典藏 |
2019-06-18T06:39:50Z |
Tool condition monitoring with current signals for a low-power spindle
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Li K.M.;Young H.T.;Chung T.T.;Wang C.;Huang M.; Wang C.; Huang M.; Chung T.T.; Young H.T.; Li K.M. |
| 臺大學術典藏 |
2018-09-10T15:32:00Z |
Highly sensitive non-enzymatic electrochemical glucose biosensor using a photolithography fabricated micro/nano hybrid structured electrode
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Hsu, C.-W.; Su, F.-C.; Peng, P.-Y.; Young, H.-T.; Liao, S.; Wang, G.-J.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T15:20:37Z |
High-speed spindle fault diagnosis with the empirical mode decomposition and multiscale entropy method
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Hsieh, N.-K.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T14:55:15Z |
An intelligent fault diagnosis system for machine tools
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HONG-TSU YOUNG;Young, H.-T.;Lin, W.-Y.;Wang, C.;HONG-TSU YOUNG; Wang, C.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Using Grey relational analysis to determine wet chemical etching parameters in through-silicon-via etching application
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HONG-TSU YOUNG; HONG-TSU YOUNG;Young, H.-T.;Tang, C.-W.;HONG-TSU YOUNG; Tang, C.-W.; Young, H.-T. |
| 臺大學術典藏 |
2018-09-10T09:45:20Z |
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
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Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG; KUAN-MING LI |
| 臺大學術典藏 |
2018-09-10T09:44:04Z |
A method of comparing the speed of starlight and the speed of light from a terrestrial source
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Chang, S.-T.; Tsao, H.-W.; Huang, Y.-R.; Lee, S.-L.; Chang, C.-C.; Lin, W.-C.; Tsay, H.-L.; Wang, Y.-L.; Huang, P.-H.; Hsu, M.-Y.; Hsu, C.-W.; Lin, S.-C.; Hung, Y.-J.; Shiu, Y.-L.; Hsiao, Y.-C.; Chang, J.-Y.; Tsai, D.P.; Huang, T.-M.; Young, H.-T.; Liu, Y.-C.; Chang, C.-M.; Chiang, W.-C.; Huang, J.-Y.; Chen, Y.-H.; Wu, J.; HEN-WAI TSAO et al. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
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Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M. |
| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process
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Tang, C.-W.; Young, H.-T.; Li, K.-M.; HONG-TSU YOUNG; KUAN-MING LI |
顯示項目 71-80 / 196 (共20頁)
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