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機構 日期 題名 作者
國立成功大學 2020-10 Characteristic study of bamboo fibers in preforming Chiu, Hsuan-Hao;Young, Wen-Bin
國立成功大學 2015-09 The mechanical and fire safety properties of bamboo fiber reinforced polylactide biocomposites fabricated by injection molding Young, Wen-Bin; Tsao, Yu-Chi
國立成功大學 2014-07 The application of carbon black and printing ink technology in molded interconnect devices Liu, Ren-Hao; Young, Wen-Bin
國立成功大學 2014-06-01 Modeling and numerical study of thermal-compression bonding in the packaging process using NCA Chang, Ching-Ho; Young, Wen-Bin
國立成功大學 2013-12 A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer Young, Wen-Bin
國立成功大學 2013-03 Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process Young, Wen-Bin
國立成功大學 2013-02-01 The effective permeability of the underfill flow domain in flip-chip packaging Yang, Connie; Young, Wen-Bin
國立成功大學 2013-01 Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging Lin, Shih-Wei; Young, Wen-Bin
國立成功大學 2012-06 Structural Analysis and Design of the Composite Wind Turbine Blade Wu, Wen-Hsiang; Young, Wen-Bin
國立成功大學 2011-07 Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip Young, Wen-Bin

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