| 國立成功大學 |
2020-10 |
Characteristic study of bamboo fibers in preforming
|
Chiu, Hsuan-Hao;Young, Wen-Bin |
| 國立成功大學 |
2015-09 |
The mechanical and fire safety properties of bamboo fiber reinforced polylactide biocomposites fabricated by injection molding
|
Young, Wen-Bin; Tsao, Yu-Chi |
| 國立成功大學 |
2014-07 |
The application of carbon black and printing ink technology in molded interconnect devices
|
Liu, Ren-Hao; Young, Wen-Bin |
| 國立成功大學 |
2014-06-01 |
Modeling and numerical study of thermal-compression bonding in the packaging process using NCA
|
Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2013-12 |
A Two-layer Model for the Simulation of the VARTM Process with Resin Distribution Layer
|
Young, Wen-Bin |
| 國立成功大學 |
2013-03 |
Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process
|
Young, Wen-Bin |
| 國立成功大學 |
2013-02-01 |
The effective permeability of the underfill flow domain in flip-chip packaging
|
Yang, Connie; Young, Wen-Bin |
| 國立成功大學 |
2013-01 |
Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging
|
Lin, Shih-Wei; Young, Wen-Bin |
| 國立成功大學 |
2012-06 |
Structural Analysis and Design of the Composite Wind Turbine Blade
|
Wu, Wen-Hsiang; Young, Wen-Bin |
| 國立成功大學 |
2011-07 |
Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip
|
Young, Wen-Bin |
| 國立成功大學 |
2011-04 |
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
|
Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2009-09 |
Analysis of the filling capability to the microstructures in micro-injection molding
|
Lin, Huang-Ya; Young, Wen-Bin |
| 國立成功大學 |
2009-04 |
Development of a Helicopter Landing Gear Prototype using Resin Infusion Molding
|
Young, Wen-Bin |
| 國立成功大學 |
2008-03 |
Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid
|
Hsin, I. C.; Young, Wen-Bin |
| 國立成功大學 |
2007-09 |
Analysis of filling distance in cylindrical microfeatures for microinjection molding
|
Young, Wen-Bin |
| 國立成功大學 |
2007-07-15 |
Micro-injection molding with the infrared assisted mold heating system
|
Yu, Ming-Ching; Young, Wen-Bin; Hsu, Pe-Ming |
| 國立成功大學 |
2006-08 |
Underfill of flip-chip: The effect of contact angle and solder bump arrangement
|
Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2006-07 |
Analysis of the residual stresses in the process of nanoimprint lithography
|
Young, Wen-Bin |
| 國立成功大學 |
2006-03 |
The thrust and lift of an ornithopter's membrane wings with simple flapping motion
|
Lin, Che-Shu; Hwu, Chyanbin; Young, Wen-Bin |
| 國立成功大學 |
2005-10 |
Effect of process parameters on injection compression molding of pickup lens
|
Young, Wen-Bin |
| 國立成功大學 |
2005-10 |
Study on residual stresses of thin-walled injection molding
|
Wang, Tong-Hong; Young, Wen-Bin |
| 國立成功大學 |
2005-09 |
Experimental study on the filling of a micro injection molding with cylindrical dot patterns
|
Chang, H. C.; Young, Wen-Bin |
| 國立成功大學 |
2005-05 |
Simulation of the filling process in molding components with micro channels
|
Young, Wen-Bin |
| 國立成功大學 |
2005-02-05 |
Analysis of the nanoimprint lithography with a viscous model
|
Young, Wen-Bin |
| 國立成功大學 |
2004-06 |
A model for underfill viscous flow considering the resistance induced by solder bumps
|
Lai, Chyi-Lang; Young, Wen-Bin |
| 國立成功大學 |
2004-06 |
Microinjection molding with LIGA-Like process
|
Yang, S. P.; Young, Wen-Bin |
| 國立成功大學 |
2004-05-15 |
Capillary impregnation into cylinder banks
|
Young, Wen-Bin |
| 國立成功大學 |
2004-03 |
Three dimensional analysis of shape deformation in injection molded optical lens
|
Young, Wen-Bin |
| 國立成功大學 |
2004-02-26 |
Analysis of capillary flows in non-uniform cross-sectional capillaries
|
Young, Wen-Bin |
| 國立成功大學 |
2004-02-01 |
Residual stress induced by solidification of thermoviscoelastic melts in the postfilling stage
|
Young, Wen-Bin |
| 國立成功大學 |
2003-11 |
Anisotropic behavior of the capillary action in flip chip underfill
|
Young, Wen-Bin |
| 國立成功大學 |
2002-12 |
Underfill viscous flow between parallel plates and solder bump
|
Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-11 |
The effect of solder bump pitch on the underfill flow
|
Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-09 |
Residual stress and warpage models for complex injection molded parts
|
Young, Wen-Bin; Wang, J. |
| 國立成功大學 |
2002-06 |
Process design for reducing the warpage in thin-walled injection molding
|
Wang, T. H.; Young, Wen-Bin; Wang, J. |
| 國立成功大學 |
2002-04 |
Study of the bending induced gap in fiber preforming of woven fiber mats
|
Gao, Zheng-Sen; Young, Wen-Bin |
| 國立成功大學 |
2000-12 |
Filling and postfilling analysis of injection/compression molding
|
Young, Wen-Bin |
| 國立成功大學 |
2000-06 |
The effects of compression pressure on injection compression molding
|
Chen, C. M.; Young, Wen-Bin |
| 國立成功大學 |
1999-04 |
The effects of preforming induced variable permeabilities on the RTM molding flow
|
Lai, Chyi-Lang; Young, Wen-Bin |
| 國立成功大學 |
1999 |
The effect of preheater on the resin transfer molding
|
Lin, Jian-Liang; Young, Wen-Bin |
