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"young wen bin"
Showing items 26-35 of 40 (4 Page(s) Totally)
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| 國立成功大學 |
2004-06 |
Microinjection molding with LIGA-Like process
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Yang, S. P.; Young, Wen-Bin |
| 國立成功大學 |
2004-05-15 |
Capillary impregnation into cylinder banks
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Young, Wen-Bin |
| 國立成功大學 |
2004-03 |
Three dimensional analysis of shape deformation in injection molded optical lens
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Young, Wen-Bin |
| 國立成功大學 |
2004-02-26 |
Analysis of capillary flows in non-uniform cross-sectional capillaries
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Young, Wen-Bin |
| 國立成功大學 |
2004-02-01 |
Residual stress induced by solidification of thermoviscoelastic melts in the postfilling stage
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Young, Wen-Bin |
| 國立成功大學 |
2003-11 |
Anisotropic behavior of the capillary action in flip chip underfill
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Young, Wen-Bin |
| 國立成功大學 |
2002-12 |
Underfill viscous flow between parallel plates and solder bump
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-11 |
The effect of solder bump pitch on the underfill flow
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-09 |
Residual stress and warpage models for complex injection molded parts
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Young, Wen-Bin; Wang, J. |
| 國立成功大學 |
2002-06 |
Process design for reducing the warpage in thin-walled injection molding
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Wang, T. H.; Young, Wen-Bin; Wang, J. |
Showing items 26-35 of 40 (4 Page(s) Totally)
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