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"young wen bin"
Showing items 31-40 of 40 (4 Page(s) Totally)
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| 國立成功大學 |
2003-11 |
Anisotropic behavior of the capillary action in flip chip underfill
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Young, Wen-Bin |
| 國立成功大學 |
2002-12 |
Underfill viscous flow between parallel plates and solder bump
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-11 |
The effect of solder bump pitch on the underfill flow
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Young, Wen-Bin; Yang, Wen-Lin |
| 國立成功大學 |
2002-09 |
Residual stress and warpage models for complex injection molded parts
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Young, Wen-Bin; Wang, J. |
| 國立成功大學 |
2002-06 |
Process design for reducing the warpage in thin-walled injection molding
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Wang, T. H.; Young, Wen-Bin; Wang, J. |
| 國立成功大學 |
2002-04 |
Study of the bending induced gap in fiber preforming of woven fiber mats
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Gao, Zheng-Sen; Young, Wen-Bin |
| 國立成功大學 |
2000-12 |
Filling and postfilling analysis of injection/compression molding
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Young, Wen-Bin |
| 國立成功大學 |
2000-06 |
The effects of compression pressure on injection compression molding
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Chen, C. M.; Young, Wen-Bin |
| 國立成功大學 |
1999-04 |
The effects of preforming induced variable permeabilities on the RTM molding flow
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Lai, Chyi-Lang; Young, Wen-Bin |
| 國立成功大學 |
1999 |
The effect of preheater on the resin transfer molding
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Lin, Jian-Liang; Young, Wen-Bin |
Showing items 31-40 of 40 (4 Page(s) Totally)
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