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"young wen bin"
Showing items 6-15 of 40 (4 Page(s) Totally)
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| 國立成功大學 |
2013-03 |
Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process
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Young, Wen-Bin |
| 國立成功大學 |
2013-02-01 |
The effective permeability of the underfill flow domain in flip-chip packaging
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Yang, Connie; Young, Wen-Bin |
| 國立成功大學 |
2013-01 |
Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging
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Lin, Shih-Wei; Young, Wen-Bin |
| 國立成功大學 |
2012-06 |
Structural Analysis and Design of the Composite Wind Turbine Blade
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Wu, Wen-Hsiang; Young, Wen-Bin |
| 國立成功大學 |
2011-07 |
Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip
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Young, Wen-Bin |
| 國立成功大學 |
2011-04 |
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
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Chang, Ching-Ho; Young, Wen-Bin |
| 國立成功大學 |
2009-09 |
Analysis of the filling capability to the microstructures in micro-injection molding
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Lin, Huang-Ya; Young, Wen-Bin |
| 國立成功大學 |
2009-04 |
Development of a Helicopter Landing Gear Prototype using Resin Infusion Molding
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Young, Wen-Bin |
| 國立成功大學 |
2008-03 |
Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid
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Hsin, I. C.; Young, Wen-Bin |
| 國立成功大學 |
2007-09 |
Analysis of filling distance in cylindrical microfeatures for microinjection molding
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Young, Wen-Bin |
Showing items 6-15 of 40 (4 Page(s) Totally)
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