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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立成功大學 |
2012-10 |
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process
|
Lin, Kwang-Lung; Lin, Yu-Wei; Yu, Chang-Ho |
| 國立成功大學 |
2008-08-11 |
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate
|
Pan, Chien-Cheng; Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2006-07-10 |
錫鋅銀銲錫合金元素在焊錫過程對銅金屬反應影響之研究
|
余昌和; Yu, Chang-Ho |
| 國立成功大學 |
2006-07-10 |
錫鋅銀銲錫合金元素在焊錫過程對銅金屬反應影響之研究
|
余昌和; Yu, Chang-Ho |
| 國立成功大學 |
2006-02-06 |
The atomic-scale studies of the behavior of the crystal dissolution in a molten metal
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2005-05 |
Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2005-03 |
Early dissolution behavior of copper in a molten Sn-Zn-Ag solder
|
Yu, Chang-Ho; Lin, Kwang-Lung |
Showing items 1-7 of 7 (1 Page(s) Totally)
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