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| 國立交通大學 |
2020-10-05T02:01:56Z |
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Yang, Yu-Tao; Hu, Han-Wen; Liu, Yu-Wei; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2020-10-05T02:01:28Z |
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
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Chou, Tzu-Chieh; Yang, Kai-Ming; Li, Jian-Chen; Yu, Ting-Yang; Chung, Ying-Ting; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-03T06:48:03Z |
High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si Substrate
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Chi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-03T06:47:10Z |
High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding Technology
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Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
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Pan, Yu-Ming; Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 義守大學 |
2018-09 |
探討生化參數與640切CT冠狀動脈鈣化指數影像之相關性
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楊玉婷; Yu-Ting Yang |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
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Chen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
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Huang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
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Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:59Z |
High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
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Chi, Nai-Chen; Yu, Ting-Yang; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Yang, Yu-Tao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
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Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang |
| 國立交通大學 |
2018-08-21T05:53:22Z |
Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer
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Yu, Ting-Yang; Liang, Hag-Wen; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:01Z |
Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologies
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Yu, Ting-Yang; Chi, Nai-Chen; Tsai, Hsin-Cheng; Wang, Shiang-Yu; Luo, Chih-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:52:44Z |
Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration
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Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:06Z |
Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration
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Liang, Hao-Wen; Yu, Ting-Yang; Chang, Yao-Jen; Chen, Kuan-Neng |
| 義守大學 |
2016-03 |
Monitoring Fractional Anisotropy in Developing Rabbit Brain Using MR Diffusion Tensor Imaging at 3T
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Jo-Chi Jao;Yu-Ting Yang;Chia-Chi Hsiao;Po-Chou Chen |
| 義守大學 |
2013-08 |
以磁振擴散張量造影觀察紐西蘭大白兔之神經系統發育
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楊玉婷; Yu-Ting Yang |
| 義守大學 |
2013-07 |
Preliminary study of non-invasive shock wave treatment of capsular contracture after breast implant: Animal model
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Yu-Chiuan Wu;Jo-Chi Jao;Yu-Ting Yang;Hsiang-Sheng Wang;Chun-Hsien Wu;Po-Chou Chen |
| 中原大學 |
2012-02-07 |
自我效能與壓力相關疲勞：直接心理生理反應路徑與間接因應行為路徑的影響
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楊于婷; Yu-Ting Yang |
| 臺北市立大學 |
2008-12-01 |
運用STS教學將環境教育融入國小生活課程之研究
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黃萬居; 黃詩惠; 楊宇婷; Wanchu Huang; Shih-Hui Huang; Yu-Ting Yang |
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