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"zhan c j"的相关文件
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| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test
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Cheng, C.-Y.; Zhan, C.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2018-09-10T09:21:52Z |
Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design
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Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU |
| 國立交通大學 |
2015-07-21T11:21:00Z |
Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integration
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Chang, Y. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:29:39Z |
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
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Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T. |
| 臺大學術典藏 |
2012 |
Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer
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Zheng, T.-Y.; Chuang, H.-H.; Wang, C.-D.; Chen, P.-S.; Kuo, T.-Y.; Zhan, C.-J.; Wu, S.-H.; Lo, W.-C.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chang, Y.-J.; YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU et al. |
| 國立臺灣大學 |
2007 |
Durability of Indium Tin Oxide-Silver-Indium Tin Oxide Films against Moisture Investigated Through the Wettability of the Top Oxide Layer
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Chen, S. W.; Bai, C. Y.; Jain, C. C.; Zhan, C. J.; Koo, C. H. |
| 國立臺灣大學 |
2006 |
Effects of high niobium addition on the microstructural and high-temperature properties of Ti-40Al-xNb alloy
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Zhan, C. J.; Yu, T. H.; Koo, C. H. |
| 國立臺灣大學 |
2006 |
Creep behavior of Ti-40Al-10Nb titanium aluminide intermetallic alloy
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Zhan, C. J.; Yu, T. H.; Koo, C. H. |
| 國立臺灣大學 |
2006 |
Creep behavior of Ti-40Al-16Nb intermetallic alloy and strengthening effects of minor Sc
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Zhan, C. J.; Koo, C. H. |
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