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Showing items 1-9 of 9 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:53:32Z |
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
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Chang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye |
| 國立交通大學 |
2017-04-21T06:49:47Z |
Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters
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Hsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
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Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:48:57Z |
Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration
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Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections
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Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H. |
| 國立成功大學 |
2012-03 |
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
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Chang, Hung-Jen; Zhan, Chau-Jie; Chang, Tao-Chih; Chou, Jung-Hua |
| 國立成功大學 |
2011-11 |
Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test
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Chang, Hung-Jen; Chang, Tao-Chih; Zhan, Chau-Jie; Chou, Jung-Hua |
| 國立成功大學 |
2011-06 |
Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
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Chang, Hung-Jen; Chou, Jung-Hua; Chang, Tao-Chih; Zhan, Chau-Jie; Hon, Min-Hsiung; Hsi, Chi-Shiung |
| 國立臺灣大學 |
2006 |
鈦鋁介金屬合金(TiAl-Nb)顯微結構與高溫性質研究
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詹朝傑; Zhan, Chau-Jie |
Showing items 1-9 of 9 (1 Page(s) Totally)
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