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Institution Date Title Author
國立交通大學 2018-08-21T05:53:32Z A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps Chang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye
國立交通大學 2017-04-21T06:49:47Z Bump Resistance Change Behavior due to Cu-Sn IMCs Formation with Various Solder Diameters Hsieh, Wan-Lin; Lin, Chung-Kuang; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih
國立交通大學 2017-04-21T06:49:07Z Electromigration in microbumps with Cu-Sn intermetallic compounds Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih
國立交通大學 2017-04-21T06:48:57Z Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih
國立交通大學 2015-12-02T03:00:57Z Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.
國立成功大學 2012-03 Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test Chang, Hung-Jen; Zhan, Chau-Jie; Chang, Tao-Chih; Chou, Jung-Hua
國立成功大學 2011-11 Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test Chang, Hung-Jen; Chang, Tao-Chih; Zhan, Chau-Jie; Chou, Jung-Hua
國立成功大學 2011-06 Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly Chang, Hung-Jen; Chou, Jung-Hua; Chang, Tao-Chih; Zhan, Chau-Jie; Hon, Min-Hsiung; Hsi, Chi-Shiung
國立臺灣大學 2006 鈦鋁介金屬合金(TiAl-Nb)顯微結構與高溫性質研究 詹朝傑; Zhan, Chau-Jie

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