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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Institution Date Title Author
臺大學術典藏 2022-03-22T08:30:22Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2021-11-21T23:18:57Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu, Z. X.; Renganathan, Vengudusamy; Kao, C. R.
臺大學術典藏 2019-11-27T02:02:34Z Volume shrinkage induced by interfacial reactions in micro joints Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏 2019-11-27T02:02:34Z Volume shrinkage induced by interfacial reactions in micro joints Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏 2019-11-27T02:02:26Z Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:26Z Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO

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