臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 1-8 of 8 (1 Page(s) Totally)
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Institution	Date	Title	Author
臺大學術典藏	2022-03-22T08:30:22Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:27:23Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2021-11-21T23:18:57Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu, Z. X.; Renganathan, Vengudusamy; Kao, C. R.
臺大學術典藏	2019-11-27T02:02:34Z	Volume shrinkage induced by interfacial reactions in micro joints	Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏	2019-11-27T02:02:34Z	Volume shrinkage induced by interfacial reactions in micro joints	Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏	2019-11-27T02:02:26Z	Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique	C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:26Z	Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique	C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO

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