臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
臺大學術典藏	2020-05-12T02:52:54Z	Effect of solder creep on the reliability of large area die attachment	Zhuang, W.D.; Chang, P.C.; Chou, F.Y.; Shiue, R.K.; REN-KAE SHIUE

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