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Institution Date Title Author
臺大學術典藏 2021-11-22T09:11:36Z Oxidation of Stainless Steel Induced by Femtosecond and Nanosecond Laser Ablation: A Comparative Raman Study Lin, F.F.; Young, H.T.; Wang, J.K.; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:37Z Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer Young, H.T.; Liao, H.T.; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:37Z Morphologic Characterization on Ablated PMMA by Femtosecond Laser Pulses Fang-Fei Lin; Ting-Yu Yeng; Hong-Tsu Young; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:37Z Modeling on Dressing Effects in Chemical Mechanical Polishing with Diamond Dressers Chen, K.R.; Young, H.T.; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:37Z Microlenticular lens replication by the combination of gas-assisted imprint technology and LIGA-like process Chia-Hung Yeh; Ching-Jui Shih; Hsuan-Cheng Wang; Fuh-Yu Chang; Hong-Tsu Young; Wen-Chuan Chang; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:38Z Innovative through-silicon-via formation approach for wafer-level packaging applications Chao-Wei Tang; Hong-Tsu Young; Kuan-Ming Li; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:38Z Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process Chao-Wei Tang; Kuan-Ming Li; Hong-Tsu Young; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:38Z Enhancement of Through Silicon VIA Sidewall Quality by Nanosecond Laser Pulses with Chemical Etching Process Tang, C.W.; Tseng, S.C.; Young, H.T.; Li, K.M.; Yang, M.; Liao, H.C.; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:38Z Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process Chen, Y.J.; Tang, C.W; Young, H.T.; Gou M.H.; HONG-TSU YOUNG
臺大學術典藏 2021-11-22T09:11:39Z Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process Chen, K.R.; Young, H.T.; HONG-TSU YOUNG

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