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Showing items 2243676-2243685 of 2346973 (234698 Page(s) Totally) << < 224363 224364 224365 224366 224367 224368 224369 224370 224371 224372 > >> View [10|25|50] records per page
| 臺大學術典藏 |
2021-11-22T09:11:36Z |
Oxidation of Stainless Steel Induced by Femtosecond and Nanosecond Laser Ablation: A Comparative Raman Study
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Lin, F.F.; Young, H.T.; Wang, J.K.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:37Z |
Novel Method to Investigate the Critical Depth of Cut of Ground Si Wafer
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Young, H.T.; Liao, H.T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:37Z |
Morphologic Characterization on Ablated PMMA by Femtosecond Laser Pulses
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Fang-Fei Lin; Ting-Yu Yeng; Hong-Tsu Young; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:37Z |
Modeling on Dressing Effects in Chemical Mechanical Polishing with Diamond Dressers
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Chen, K.R.; Young, H.T.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:37Z |
Microlenticular lens replication by the combination of gas-assisted imprint technology and LIGA-like process
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Chia-Hung Yeh; Ching-Jui Shih; Hsuan-Cheng Wang; Fuh-Yu Chang; Hong-Tsu Young; Wen-Chuan Chang; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:38Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
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Chao-Wei Tang; Hong-Tsu Young; Kuan-Ming Li; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:38Z |
Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process
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Chao-Wei Tang; Kuan-Ming Li; Hong-Tsu Young; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:38Z |
Enhancement of Through Silicon VIA Sidewall Quality by Nanosecond Laser Pulses with Chemical Etching Process
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Tang, C.W.; Tseng, S.C.; Young, H.T.; Li, K.M.; Yang, M.; Liao, H.C.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:38Z |
Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process
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Chen, Y.J.; Tang, C.W; Young, H.T.; Gou M.H.; HONG-TSU YOUNG |
| 臺大學術典藏 |
2021-11-22T09:11:39Z |
Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process
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Chen, K.R.; Young, H.T.; HONG-TSU YOUNG |
Showing items 2243676-2243685 of 2346973 (234698 Page(s) Totally) << < 224363 224364 224365 224366 224367 224368 224369 224370 224371 224372 > >> View [10|25|50] records per page
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