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Institution	Date	Title	Author
臺大學術典藏	2022-03-22T08:25:56Z	Aerosol jet printing of nickel oxide nanoparticle ink with ultraviolet radiation curing for thin-film temperature sensors	Chang Y.-T;Hung K.-Y;Young H.-T;Li K.-M;Chen R.K.; Chang Y.-T; Hung K.-Y; Young H.-T; Li K.-M; Chen R.K.; KUAN-MING LI
臺大學術典藏	2022-03-22T08:25:57Z	Transitions of bouncing and coalescence in binary droplet collisions	Huang K.-L;Pan K.-L.; Huang K.-L; Pan K.-L.; KUO-LONG PAN
臺大學術典藏	2022-03-22T08:25:57Z	Laser Patterning Technology Based on Nanosecond Pulsed Laser for Manufacturing Bifacial Perovskite Solar Modules	Lin B.-Q;Huang C.-P;Tian K.-Y;Lee P.-H;Su W.-F;Xu L.; Lin B.-Q; Huang C.-P; Tian K.-Y; Lee P.-H; Su W.-F; Xu L.; LI XU
臺大學術典藏	2022-03-22T08:25:57Z	Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner	Wu G.-W;Chen L.-C.; Wu G.-W; Chen L.-C.; LIANG-CHIA CHEN
臺大學術典藏	2022-03-22T08:25:57Z	Continuous wave laser nanowelding process of ag nanowires on flexible polymer substrates	Xu L;Weng W.-C;Yeh Y.-C.; Xu L; Weng W.-C; Yeh Y.-C.; LI XU
臺大學術典藏	2022-03-22T08:25:58Z	High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry	Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN
臺大學術典藏	2022-03-22T08:25:58Z	The size effect on the interfacial thermal resistances of sandwich structures	Huang M.-J;Tsai P.-K.; Huang M.-J; Tsai P.-K.; MEI-JIAU HUANG
臺大學術典藏	2022-03-22T08:25:58Z	New machine functions using waste heat recovery: A case study of atmospheric pressure plasma jet	Hsu P.-C;Saragih A.A;Huang M.-J;Juang J.-Y.; Hsu P.-C; Saragih A.A; Huang M.-J; Juang J.-Y.; MEI-JIAU HUANG
臺大學術典藏	2022-03-22T08:25:59Z	A design and verification of a non-icing and non-condensing waste-cold-recovery system	Lin M.-C;Chen H.-Y;Chung F.-T;Huang M.-J.; Lin M.-C; Chen H.-Y; Chung F.-T; Huang M.-J.; MEI-JIAU HUANG
臺大學術典藏	2022-03-22T08:25:59Z	The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology	Yen C;Chang S;Chen K;Feng Y;Chen L;Liao B;Lee M;Chen S;Liao M.; Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO

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