臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2023	An Intuitive Human-Manipulator Interface with Mixed Reality	Chang, Y.-W.;Hsu, S.-T.;Yeh, H.-H.;Liu, Y.-C.
國立成功大學	2023	V-SLAM Enhanced INS/GNSS Fusion Scheme for Lane Level Vehicular Navigation Applications in Dynamic Environment	Yeh, T.-H.;Chiang, K.-W.;Lu, P.-R.;Li, P.-L.;Lin, Y.-S.;Hsu, C.-Y.
國立成功大學	2023	Group Trip Planning Approach with Travel Time and Ratio Constraints	Huang, Huang H.-Y.;Lu, E.H.-C.;Tu, C.-H.
國立成功大學	2023	Establishment of HD Maps Verification and Validation Procedure with OpenDRIVE and Autoware (Lanelet2) Formats	Chiang, K.-W.;Tsai, M.-L.;Lin, S.;Huang, Y.-E.;Zeng, J.-C.;Chang, Y.-F.;Chen, J.-A.;Huang, Y.-C.;Yang, C.-S.;Juang, Juang J.-C.;Wang, C.-K.;Lin, C.-F.;Lee, J.;Darweesh, H.;Li, P.-L.
國立成功大學	2023	Distributed Persistent Coverage Control over Importance-based Environments with Quadrotors	Thummalapeta, M.;Liu, Y.-C.
國立成功大學	2023	A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force	Wang, C.-Y.;Chiu, T.-C.;Yin, W.-J.;Chen, D.-L.;Chen, T.-Y.;Kao, C.-L.
國立成功大學	2023	A Study of Underfill Dispensing Patterns in Flip-Chip Packaging	Chen, D.-L.;Chang, H.-J.;Chen, T.-Y.;Hu, Y.-H.;Chen, T.-B.;Pan, C.-H.;Yang, Yang Y.-S.;Hwang, S.-J.
國立成功大學	2023	A machine learning approach to explore tensile properties of low-temperature solders	Liu, Y.-C.;Kholik, A.;Lin, S.-K.
國立成功大學	2023	Analysis of Panel Warping for multilayer RDL Process and Extraction of Dielectric Properties of Photosensitive Polyimide on Fan-out Panel Level Packaging	Ho, C.-Y.;Po-Yang;Hung
國立成功大學	2023	Predicting Temperature of Carbon Brick in a Blast Furnace Using Machine Learning Approaches	Wu, C.-H.;Huang, Y.-W.;Lin, F.-S.;Chen, Y.-H.;Huang, C.-H.;Ko, C.

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