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Institution Date Title Author
臺大學術典藏 2022-03-22T08:27:22Z White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5 Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Numerical analysis of an electroless plating problem in gas–liquid two-phase flow Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:24Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:24Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:24Z Microstructure and corrosion behavior of FeCrNiCoMnx (x = 1.0, 0.6, 0.3, 0) high entropy alloys in 0.5 M H2SO4 Hsu K.-M;Chen S.-H;Lin C.-S.; Hsu K.-M; Chen S.-H; Lin C.-S.; CHAO-SUNG LIN
臺大學術典藏 2022-03-22T08:27:25Z Corrosion resistance and electrical contact resistance of a thin permanganate conversion coating on dual-phase LZ91 Mg–Li alloy Hung S.-M;Lin H;Chen H.-W;Chen S.-Y;Lin C.-S.; Hung S.-M; Lin H; Chen H.-W; Chen S.-Y; Lin C.-S.; CHAO-SUNG LIN
臺大學術典藏 2022-03-22T08:27:25Z Surface PEGylation via Ultrasonic Spray Deposition for the Biofouling Mitigation of Biomedical Interfaces Tang S.-H;Venault A;Chou L.-H;Lan D.-H;Dizon G.V;Hsieh C;Yeh C.-C;Liu C.-L;Chang Y.; Tang S.-H; Venault A; Chou L.-H; Lan D.-H; Dizon G.V; Hsieh C; Yeh C.-C; Liu C.-L; Chang Y.; CHENG-LIANG LIU
臺大學術典藏 2022-03-22T08:27:25Z Solution Processable Pentafluorophenyl End-Capped Dithienothiophene Organic Semiconductors for Hole-Transporting Organic Field Effect Transistors Velusamy A;Yang Y.-C;Lin C.-C;Afraj S.N;Jiang K;Chen P.-S;Yau S.-L;Osaka I;Tung S.-H;Chen M.-C;Liu C.-L.; Liu C.-L.; CHENG-LIANG LIU et al.

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