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Showing items 512126-512150 of 2302604 (92105 Page(s) Totally) << < 20481 20482 20483 20484 20485 20486 20487 20488 20489 20490 > >> View [10|25|50] records per page
國立勤益科技大學 |
1999-06 |
Intermetallic phase formation and shear strength of a Au-In microjoint
|
Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C. |
國立成功大學 |
2014 |
Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure
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Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen |
臺大學術典藏 |
2018-06-28T22:11:31Z |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
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Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
|
Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Lin, Hsiu-Jen; Chuang, Tung-Han |
臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads
|
TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J. |
臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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Chuang, T.H.; Jain, C.C.; Wu, H.M. |
臺大學術典藏 |
2009-01-06T01:28:22Z |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
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Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han |
國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
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Chi, Chih-Chien; Chuang, Tung-Han |
臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG |
國立成功大學 |
2012-10 |
Intermetallic solid solution Fe1-xCoxGa3: Synthesis, structure, NQR study and electronic band structure calculations
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Verchenko, V. Yu; Likhanov, M. S.; Kirsanova, M. A.; Gippius, A. A.; Tkachev, A. V.; Gervits, N. E.; Galeeva, A. V.; Buettgen, N.; Kraetschmer, W.; Lue, C. S.; Okhotnikov, K. S.; Shevelkov, A. V. |
嘉南藥理大學 |
2009 |
Intermetallics
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Elsevier SDOL |
國立臺灣大學 |
1991-06 |
Intermetallics Research and Development in Taiwan, R. O. C.
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許樹恩; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; 吳錫侃; Hsu, Shu-En; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; Wu, Shyi-Kaan |
中國文化大學 |
2011-12 |
Intermetropolitan Networks of Co-invention in American Biotechnology
|
李德軒 |
Showing items 512126-512150 of 2302604 (92105 Page(s) Totally) << < 20481 20482 20483 20484 20485 20486 20487 20488 20489 20490 > >> View [10|25|50] records per page
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