| 淡江大學 |
2002-09-01 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-dong; Yeh, Ho-ming; Wang, Wen-pen |
| 淡江大學 |
2002-04-20 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-Dong;Yeh, Ho-Ming;Wang, Wen-Pen |
| 國立成功大學 |
2014 |
Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
|
Tsai, Pai-Yang; Huang, Hou-Kuei; Sung, Chien-Min; Kan, Ming-Chi; Wang, Yeong-Her |
| 國立交通大學 |
2020-05-05T00:01:57Z |
Thermal Characteristics of the Three-Section Distributed Feedback Lasers
|
Cheng, Yuh-Jen; Lin, Chien-Chung; Hsu, Shun-Chieh; Chang, Shu-Hsiu; Shih, Hsiang-Yun; Huang, Chung-Ping |
| 國立中山大學 |
1986 |
Thermal Characteristics of the Trombe Wall Applied to Passive Solar Heating/Storage Systems
|
S.S. Hsieh; C.T. Tsai |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 國立臺灣科技大學 |
2013 |
Thermal characterization of a chip-on-wafer-on-substrate with wide-IO bus
|
Tsai, K.-Y.;Xu, S.S.-D.;Lo, Y.-K.;Chang, W.-Y. |
| 國立成功大學 |
2019-06-1 |
Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material
|
Shih;H, M.;Lin;Yi-Pin;Lin;L, P.;Lai;Chi-Ming |
| 國立交通大學 |
2014-12-08T15:19:50Z |
THERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITES
|
Chang, Chih-Jong; Chang, Chih-Hao; Hwang, Jen-Dong; Kuo, Cheng-Tzu |
| 國立高雄應用科技大學 |
2011 |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:26:43Z |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:05:38Z |
THERMAL CHARACTERIZATION OF SYNTHESIZED Y2O3-CEO2-ZRO2
|
DUH, JG; LEE, MY; CHIOU, BS |
| 中華大學 |
2008 |
THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
|
陳精一; Chen, Ching-I |
| 國立成功大學 |
2004-07-30 |
Thermal chip fabrication with arrays of sensors and heaters for micro-scale impingement cooling heat transfer analysis and measurements
|
Shen, C. H.; Gau, Chie |
| 國立彰化師範大學 |
2005-06 |
Thermal Comfort Control on Multi-room Fan Coil Unit System Using LEE-based Fuzzy Logic
|
Chu, Chi-Min; Jong, Tai-Lang; Huang, Yue-Wei |
| 國立成功大學 |
2013 |
Thermal Comfort for Urban Parks in Subtropics: Understanding Visitor's Perceptions, Behavior and Attendance
|
Lin, Chuang-Hung; Lin, Tzu-Ping; Hwang, Ruey-Lung |
| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
|
Chen, Tungyang |
