| 國立成功大學 |
2013 |
Thermal Comfort for Urban Parks in Subtropics: Understanding Visitor's Perceptions, Behavior and Attendance
|
Lin, Chuang-Hung; Lin, Tzu-Ping; Hwang, Ruey-Lung |
| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
|
Chen, Tungyang |
| 國立臺灣科技大學 |
2013 |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
Kuo, D.H.;Lin, C.Y.;Jhou, Y.C.;Cheng, J.Y.;Liou, G.S. |
| 臺大學術典藏 |
2018-09-10T09:43:06Z |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
GUEY-SHENG LIOU;Liou, G.S.;Cheng, J.Y.;Jhou, Y.C.;Lin, C.Y.;Kuo, D.H.;GUEY-SHENG LIOU; Kuo, D.H.; Lin, C.Y.; Jhou, Y.C.; Cheng, J.Y.; Liou, G.S.; GUEY-SHENG LIOU |
| 元智大學 |
2015-07-12 |
THERMAL CONDUCTIVITIES OF ALIGNED CNT NANOCOMPOSITES
|
M. W. Wang; C. C. Liao; Niann-i YU |
| 元智大學 |
2011-12-10 |
Thermal Conductivities of CNT/Epoxy Composites
|
C. Huang; Niann-i YU |
| 元智大學 |
2017-07-16 |
THERMAL CONDUCTIVITIES OF GNP/CNT/EPOXY COMPOSITES
|
C.P. Su; Niann-i YU |
| 元智大學 |
2015-11-20 |
Thermal Conductivities of GNP/CNT/Epoxy Nanocomposites
|
C. P. Su; Niann-i YU |
| 元智大學 |
2014-11-21 |
Thermal Conductivities of GNP/Epoxy Composites
|
K. Y. Huang; Niann-i YU |
| 元智大學 |
2006-12 |
Thermal conductivities of multiwalled carbon nanotube/epoxy Composites
|
江右君; 唐伯偉; 余念一 |
| 元智大學 |
2020 |
Thermal Conductivity Analysis and Optimization of the Locking Positions of a DC-DC Voltage Converter for the Hybrid Electric Vehicle Power System
|
Di-Jun Chen; 陳帝均 |
| 國立成功大學 |
2017 |
Thermal conductivity and dielectric properties of PEDOT:PSS-AlN filler reinforced water-soluble polymer composites
|
Yang;Chang-Ting;Hsiang;Hsing-I;Huang;Tzu-Sheng;Huang;Pei-Chen;Han;Yu-Kai |
| 國立臺灣科技大學 |
2013 |
Thermal conductivity and electrical conductivity of silicone rubber filled with aluminum nitride and aluminum powder
|
Chiu, H.-T.;Liu, Y.-L.;Lin, C.-W.;Shong, Z.-J.;Tsai, P.-A. |
| 臺大學術典藏 |
2021-10-21T23:28:13Z |
Thermal conductivity and electrical resistivity of single copper nanowires
|
Peng, Wei Tsu; Chen, Fu Ren; MING-CHANG LU |
| 國立勤益科技大學 |
2011-07 |
Thermal Conductivity and Morphology of Silver-Filled Multi-Walled Carbon Nanotubes/Polyimide Nanocomposite Films
|
蔡美慧 |
| 中國文化大學 |
2019-10 |
Thermal conductivity and stability for ultrathin SiO2 nanowires: insight from molecular dynamics simulation
|
Su, CH (Su, Chia-Hao); Chen, HL (Chen, Hui-Lung); Ju, SP (Ju, Shin-Pon); Liao, BY (Liao, Bo-Yuan); Pan, CT (Pan, Cheng-Tang) |
| 國立交通大學 |
2014-12-08T15:20:33Z |
Thermal conductivity and structure of non-covalent functionalized graphene/epoxy composites
|
Teng, Chih-Chun; Ma, Chen-Chi M.; Lu, Chu-Hua; Yang, Shin-Yi; Lee, Shie-Heng; Hsiao, Min-Chien; Yen, Ming-Yu; Chiou, Kuo-Chan; Lee, Tzong-Ming |
| 元智大學 |
2012-07-01 |
Thermal conductivity enhancement and shape-stabilization of phase change materials using nanographite additives
|
J.N. Shi; N.W. Pu; Y.M. Liu; Y.C. Fan; N.T. Wen; C.K. Lin; M.D. Ger |
