| 國立臺灣大學 |
2002 |
Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing
|
Tsao, L. C.; Su, T. L.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
|
Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S. |
| 國立臺灣大學 |
2002 |
Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements
|
Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S. |
| 國立臺灣大學 |
2002 |
Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals
|
Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
|
Chiang, M. J.; Chuang, T. H. |
| 臺大學術典藏 |
2002 |
Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions
|
ChuangTH; Wang, S. S.; Chang, S. Y.; Yu, C. L.; Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2002 |
Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates
|
Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y. |
| 國立臺灣大學 |
2001 |
Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals
|
Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2001 |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint
|
Chuang, T. H.; Huang, Y. T.; Tsao, L. C. |
| 國立臺灣大學 |
2001 |
Evaluation of Superplastic Formability of the AZ31, Magnesium Alloy
|
Tsao, L. C.; Wu, C. F.; Chuang, T. H. |
| 國立臺灣大學 |
2001 |
Surface Self-Cleaning Effect of Zn-22 Alloy during Superplastic Deformation
|
Chuang, T. H.; Tsao, L. C. |
| 國立臺灣大學 |
2001 |
Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu Based Filler Metals
|
Tsao, L. C.; Tsai, T. C.; Wu, C. S.; Chuang, T. H. |
| 國立臺灣大學 |
2001 |
The Ultra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material
|
Tsao, L. C.; Wang, S. S.; Yang, C. F.; Chuang, T. H. |
| 臺大學術典藏 |
2001 |
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint
|
ChuangTH; Huang, Y. T.; Tsao, L. C.; Chuang, T. H.; Chuang, T. H.; Huang, Y. T.; Tsao, L. C. |
| 國立臺灣大學 |
2000 |
Characterization of alumina ceramics by ultrasonic testing
|
Chang, L. -S.; Chuang, T. -H.; Wei, W. J. |
| 國立臺灣大學 |
2000 |
Brazing of zirconia with AgCuTi and SnAgTi active filler metals
|
Chuang, T. H.; Yeh, M. S.; Chai, Y. H. |
| 國立臺灣大學 |
2000 |
Plastic flow behavior during the forging of a 6061 Al/10 vol pct Al2O3 ( p ) composite
|
Yeh, M. S.; Weng, W. P.; Wang, S. C.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y. M.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Temperature Effects on the Erosion of Aluminum Alloy
|
Fang, C. K.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Diffusion bonding of a superplastic inconel 718SPF superalloy by electroless nickel plating
|
Yeh, M. S.; Chang, C. B.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Evaluation of Low Temperature Superplastic Formability for Zn-22Ae Thin Sheets
|
Tsao, L. C.; Yeh, M. S.; Lo, C. J.; Wu, F. C.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Development of a low-melting-point filler metal for brazing aluminum alloys
|
Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
