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"chuang t h"的相关文件
显示项目 271-280 / 384 (共39页)
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| 國立臺灣大學 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F. |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
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Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 國立臺灣大學 |
2004 |
Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions
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Chuang, T. H.; Huang, K. W.; Lin, W. H. |
| 國立臺灣大學 |
2004 |
Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints
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Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J. |
| 臺大學術典藏 |
2004 |
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
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Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH |
| 臺大學術典藏 |
2004 |
Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions
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ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H. |
| 臺大學術典藏 |
2004 |
Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))
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Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2003 |
Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy
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Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. |
| 國立臺灣大學 |
2003 |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M. |
| 國立臺灣大學 |
2003 |
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
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Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H. |
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