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機構	日期	題名	作者
國立臺灣大學	2004	Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates	Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.
國立臺灣大學	2004	Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages	Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.
國立臺灣大學	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	Chuang, T. H.; Huang, K. W.; Lin, W. H.
國立臺灣大學	2004	Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints	Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J.
臺大學術典藏	2004	Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates	Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH
臺大學術典藏	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H.
臺大學術典藏	2004	Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))	Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2003	Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy	Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H.
國立臺灣大學	2003	Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal	Chang, S. Y.; Hung, Y. T.; Chuang, T. H.
臺大學術典藏	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y.
臺大學術典藏	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2002	Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates	Chan, Y. C.; Chiu, M. Y.; Chuang, T. H.
國立臺灣大學	2002	Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals	Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H.
國立臺灣大學	2002	Soldering reactions between In49Sn and Ag thick films	Cheng, M. D.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates	Chiu, M. Y.; Chang, S. Y.; Tseng, Y. H.; Chan, Y. C.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed at the interface between liquid indium and copper substrates	Yu, C. L.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates	Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing	Tsao, L. C.; Su, T. L.; Chuang, T. H.
國立臺灣大學	2002	Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions	Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.
國立臺灣大學	2002	Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements	Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S.
國立臺灣大學	2002	Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals	Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學	2002	Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.

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	造訪人次 : 51902903 線上人數 : 1020 教育部委託研究計畫計畫執行:國立臺灣大學圖書館