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| 國立臺灣大學 |
2012 |
Origin and evolution of voids in electroless Ni during soldering reaction
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Chung, C.Key; Chen, Y.J.; Chen, W.M.; Kao, C.R. |
| 國立臺灣大學 |
2012 |
The critical oxide thickness for Pb-free reflow soldering on Cu substrate
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Chung, C.Key; Chen, Y.J.; Li, C.C.; Kao, C.R. |
| 國立臺灣大學 |
2010 |
Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction
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Chung, C.Key; Duh, Jenq-Gong; Kao, C.R. |
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