臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立臺灣大學	2002-06	Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni	Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2002-05	Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni	Ho, C. E.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2002-03	Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages	Shiau, L. C.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2002-02	Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders	Chen, W. T.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2001-11	Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering	Ho, C. E.; Tsai, S. Y.; Kao, and C. R.
國立臺灣大學	2001-09	Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish	Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2001-04	Interactions between solder and metallization during long-term aging of advanced microelectronic packages	Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2001-02	Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder	Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2000-10	Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish	Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R.
國立臺灣大學	2000-09	Optimizing the wire-bonding parameters for second bond in ball grid array packages	Ho, C. E.; Chen, C.; Kao, and C. R.
國立臺灣大學	1999-11	Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering	Ho, C. E.; Chen, Y. M.; Kao, and C. R.
國立臺灣大學	1999-04	Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system	Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R.

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