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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"ho c e"的相關文件
顯示項目 21-32 / 32 (共2頁) 1 2 > >> 每頁顯示[10|25|50]項目
國立臺灣大學 |
2002-06 |
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
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Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. |
國立臺灣大學 |
2002-05 |
Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
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Ho, C. E.; Lin, Y. L.; Kao, and C. R. |
國立臺灣大學 |
2002-03 |
Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages
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Shiau, L. C.; Ho, C. E.; Kao, and C. R. |
國立臺灣大學 |
2002-02 |
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
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Chen, W. T.; Ho, C. E.; Kao, and C. R. |
國立臺灣大學 |
2001-11 |
Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering
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Ho, C. E.; Tsai, S. Y.; Kao, and C. R. |
國立臺灣大學 |
2001-09 |
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
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Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R. |
國立臺灣大學 |
2001-04 |
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
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Ho, C. E.; Chen, W. T.; Kao, and C. R. |
國立臺灣大學 |
2001-02 |
Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder
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Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R. |
國立臺灣大學 |
2000-10 |
Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
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Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R. |
國立臺灣大學 |
2000-09 |
Optimizing the wire-bonding parameters for second bond in ball grid array packages
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Ho, C. E.; Chen, C.; Kao, and C. R. |
國立臺灣大學 |
1999-11 |
Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering
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Ho, C. E.; Chen, Y. M.; Kao, and C. R. |
國立臺灣大學 |
1999-04 |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
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Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R. |
顯示項目 21-32 / 32 (共2頁) 1 2 > >> 每頁顯示[10|25|50]項目
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