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Institution Date Title Author
國立交通大學 2019-04-02T06:04:42Z Active device under bond pad to save I/O layout for high-pin-count SOC Ker, MD; Peng, JJ; Jiang, HC
國立交通大學 2014-12-08T15:46:55Z A 2-D velocity- and direction-selective sensor with BJT-based silicon retina and temporal zero-crossing detector Jiang, HC; Wu, CY
國立交通大學 2014-12-08T15:46:30Z An improved BJT-based silicon retina with tunable image smoothing capability Wu, CY; Jiang, HC
國立交通大學 2014-12-08T15:43:54Z In the blink of a silicon eye Cheng, CH; Wu, CY; Sheu, B; Lin, LJ; Huang, KH; Jiang, HC; Yen, WC; Hsiao, CW
國立交通大學 2014-12-08T15:43:10Z Design on the low-capacitance bond pad for high-frequency I/O circuits in CMOS technology Ker, MD; Jiang, HC; Chang, CY
國立交通大學 2014-12-08T15:27:53Z AN ON-CHIP ESD PROTECTION CIRCUIT WITH COMPLEMENTARY SCR STRUCTURES FOR SUBMICRON CMOS ICS KER, MD; WU, CY; JIANG, HC; LEE, CY; KO, J; HSUE, P
國立交通大學 2014-12-08T15:27:18Z The BJT-based silicon-retina sensory system for direction- and velocity-selective sensing Jiang, HC; Wu, CY
國立交通大學 2014-12-08T15:27:06Z Design of low-capacitance bond pad for high-frequency I/O applications in CMOS integrated circuits Ker, MD; Jiang, HC; Chang, CY
國立交通大學 2014-12-08T15:26:50Z Automatic methodology for placing the guard rings into chip layout to prevent latchup in CMOS IC's Ker, MD; Jiang, HC; Peng, JJ; Shieh, TL
國立交通大學 2014-12-08T15:26:50Z ESD test methods on integrated circuits: An overview Ker, MD; Peng, JH; Jiang, HC
國立交通大學 2014-12-08T15:26:45Z Whole-chip ESD protection strategy for CMOS integrated circuits in nanotechnology Ker, MD; Jiang, HC
國立交通大學 2014-12-08T15:26:38Z Latchup current self-stop circuit for whole-chip latchup prevention in bulk CMOS integrated circuits Peng, JJ; Ker, MD; Jiang, HC
國立交通大學 2014-12-08T15:26:36Z Design of negative charge pump circuit with polysilicon diodes in a 0.25-mu m CMOS process Ker, MD; Chang, CY; Jiang, HC
國立交通大學 2014-12-08T15:26:28Z Failure analysis of ESD damage in a high-voltage driver IC and the effective ESD protection solution Ker, MD; Peng, JJ; Jiang, HC
國立交通大學 2014-12-08T15:26:13Z Test structure and verification on the MOSFET under bond pad for area-efficient I/O layout in high-pin-count SOCIC's Ker, MD; Peng, JJ; Jiang, HC

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