|
|
???tair.name??? >
???browser.page.title.author???
|
"juang jing ye"???jsp.browse.items-by-author.description???
Showing items 1-10 of 13 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
| 國立交通大學 |
2020-05-05T00:02:23Z |
Instant Cu-to-Cu direct bonding enabled by < 111 >-oriented nanotwinned Cu bumps
|
Shie, Kai Cheng; Juang, Jing-Ye; Chen, Chih |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin |
| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
|
Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copper
|
Shie, Kai Cheng; Juang, Jing-Ye; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
|
Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:47Z |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
|
Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient
|
Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
|
Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
Showing items 1-10 of 13 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
|
