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Showing items 1-10 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2016-12 |
Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu
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Huang, Wei-Chih; Lin, Kwang-Lung |
| 國立成功大學 |
2016-12 |
The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire
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Huang, Wei-Hsiang; Lin, Kwang-Lung; Lin, Yu-Wei; Cheng, Yun-Kai |
| 國立成功大學 |
2016-11-20 |
The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09 wt%) high temperature lead free solder
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Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current
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Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2016-03 |
The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing
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Hsiao, Yu-Hsiang; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing
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Wang, Ting-Hui; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent
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Frischa, M. W.; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
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Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
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Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-10-15 |
Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient
|
Niu, Xi; Lin, Kwang-Lung |
Showing items 1-10 of 130 (13 Page(s) Totally)
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